中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

23 records (took 0.048 seconds)

    Method and examination system for examining and processing a microscopic sample
    1.
    发明授权
    Method and examination system for examining and processing a microscopic sample 有权

    公开(公告)号：US10533931B2

    公开(公告)日：2020-01-14

    申请号：US15574492

    申请日：2016-05-20

    Applicant: Leica Microsystems CMS GmbH

    Inventor： Falk Schlaudraff ,  Blagovesta Wegner

    IPC: G01N1/28 ,  G02B21/36 ,  G06T7/73 ,  G02B21/34

    Abstract: A method for examining and processing a microscopic sample arranged on a slide includes producing reference markings on the slide by a laser beam of a laser microdissection system. A digital image of the sample and the reference markings on the slide is produced by a digital optical imaging device. An image region is defined and first position information data which indicate a position of the image region is generated. The reference markings are identified in the image and second position information data which indicate a position of the reference markings in the image is generated. The reference markings are identified, and third position information data which indicate the position of the reference markings in the laser microdissection system is generated. The first, second and third position information data are correlated and a sample region which corresponds to the image region is processed.

    SPECIMEN COLLECTOR FOR COLLECTING A LASER MICRO-DISSECTATE
    2.
    发明申请
    SPECIMEN COLLECTOR FOR COLLECTING A LASER MICRO-DISSECTATE 有权
    用于收集激光微分离的样品收集器

    公开(公告)号：US20150125363A1

    公开(公告)日：2015-05-07

    申请号：US14402122

    申请日：2013-05-22

    Applicant: LEICA MICROSYSTEMS CMS GMBH

    Inventor： Falk Schlaudraff

    IPC: G01N1/28 ,  B01L3/00

    CPC classification number: G01N1/286 ,  B01L3/502715 ,  B01L3/502738 ,  B01L3/502784 ,  B01L2200/0631 ,  B01L2200/0673 ,  B01L2200/10 ,  B01L2300/0681 ,  B01L2300/0816 ,  B01L2300/0864 ,  B01L2400/0406 ,  G01N2001/2886

    Abstract: A laser microdissectate specimen collector for a laser microdissection device includes a collecting chamber configured to receive a dissectate. The collecting chamber has, on a specimen side, an opening open to the environment for receiving the dissectate. The collecting chamber also has a first valve. The first valve, in a closed state thereof, forms a closure of the collecting chamber opposite to the opening for retaining the dissectate. A capillary line is connected downstream of the first valve to the collecting chamber such that the capillary line is configured to transport the dissectate out of the collecting chamber.

    Abstract translation: 用于激光显微切割装置的激光微解剖样本收集器包括被配置为接收解剖的收集室。 收集室在样本侧具有通向环境的开口，用于接收解剖。 收集室还具有第一阀。 第一阀在其闭合状态下形成与开口相对的收集室的封闭件，用于保持解剖。 毛细管线连接到第一阀的下游到收集室，使得毛细管线被配置成将解剖层输送出收集室。

    METHOD FOR LASER MICRODISSECTION, AND LASER MICRODISSECTION SYSTEM
    5.
    发明申请
    METHOD FOR LASER MICRODISSECTION, AND LASER MICRODISSECTION SYSTEM 审中-公开
    激光微结构的方法和激光微结构系统

    公开(公告)号：US20160210498A1

    公开(公告)日：2016-07-21

    申请号：US14599659

    申请日：2015-01-19

    Applicant: Leica Microsystems CMS GmbH

    Inventor： Falk Schlaudraff ,  Andrew Lee ,  Florian Hoffmann

    IPC: G06K9/00 ,  G02B21/36 ,  G02B21/06

    CPC classification number: G06K9/00127 ,  G01N1/286 ,  G01N2001/2886 ,  G02B21/06 ,  G02B21/32 ,  G02B21/365

    Abstract: A method for laser microdissection includes detecting at least a portion of an object to be dissected in an image-producing manner in a laser microdissection system and generating a first digital object image. A first processing specification is defined based on the first digital object image. In a first processing step, the object is processed using a laser beam of the laser microdissection system in accordance with the first processing specification. At least a portion of the object is detected in an image-producing manner and a second digital object image is generated. A second processing specification is defined during execution of the first processing step based on the second digital object image. In a second processing step, the object is processed using the laser beam of the laser microdissection system in accordance with the second processing specification.

    Abstract translation: 一种用于激光显微切割的方法包括在激光显微切割系统中以图像产生的方式检测要解剖的物体的至少一部分，并产生第一数字对象图像。 基于第一数字对象图像来定义第一处理规范。 在第一处理步骤中，使用根据第一处理规范的激光显微切割系统的激光束对物体进行处理。 以图像生成方式检测对象的至少一部分，并且生成第二数字对象图像。 基于第二数字对象图像在第一处理步骤的执行期间定义第二处理规范。 在第二处理步骤中，使用根据第二处理规范的激光显微切割系统的激光束对物体进行处理。

    IMAGING DEVICE AND METHOD
    6.
    发明公开
    IMAGING DEVICE AND METHOD 审中-公开

    公开(公告)号：US20240037755A1

    公开(公告)日：2024-02-01

    申请号：US18346881

    申请日：2023-07-05

    Applicant: Leica Microsystems CMS GmbH

    Inventor： Falk Schlaudraff

    IPC: G06T7/174 ,  G06T11/00 ,  G06T7/11 ,  G01N21/64

    CPC classification number: G06T7/174 ,  G06T11/00 ,  G06T7/11 ,  G01N21/6458 ,  G06T2207/10056 ,  G06T2207/10064 ,  G06T2207/10152

    Abstract: An imaging device for imaging a sample includes an excitation unit configured to emit excitation light for exciting a first fluorophore attached to a first feature of the sample and at least a second feature of the sample, and a detection unit configured to receive fluorescence light from the first fluorophore, and generate at least one fluorescence image from the received fluorescence light. The imaging device further includes a controller configured to determine, based on an image segmentation, a first image region of the fluorescence image corresponding to the first feature and a second image region of the fluorescence image corresponding to the second feature, generate a first image based on the first image region and a second image based on the second image region, and/or generate a composite image comprising at least the first image region and the second image region.

    Laser microdissection method and laser microdissection systems
    7.
    发明授权
    Laser microdissection method and laser microdissection systems 有权

    公开(公告)号：US11085855B2

    公开(公告)日：2021-08-10

    申请号：US16310825

    申请日：2017-06-27

    Applicant: LEICA MICROSYSTEMS CMS GMBH

    Inventor： Falk Schlaudraff ,  Andrew K. Lee

    IPC: G01N1/28 ,  G01J1/42 ,  G02B21/08 ,  A61B18/20

    Abstract: A method for performing a laser microdissection for cutting a dissectate from a specimen using a laser includes the step of providing the specimen in a light path of an illumination system. The specimen is illuminated by the illumination system. A detector detects light emanating from the specimen. The light detected by the detector is analyzed. It is determined, based on the analysis of the light detected by the detector, whether a receptacle for collecting the dissectate is disposed in a predetermined collection position, at which the dissectate is to be collected in the receptacle after it is cut from the specimen. Laser cutting of the dissectate from the specimen is initiated based on it having been determined that the receptacle is in the predetermined collection position.

    LASER MICROSCOPE SYSTEM
    8.
    发明申请
    LASER MICROSCOPE SYSTEM 审中-公开

    公开(公告)号：US20200310092A1

    公开(公告)日：2020-10-01

    申请号：US16310835

    申请日：2017-06-30

    Applicant: Leica Microsystems CMS GmbH

    Inventor： Falk Schlaudraff

    IPC: G02B21/00

    Abstract: A laser microscope system includes a microscope and a lens defining an optical axis and a rear focal plane, as well as a laser and an optical laser system coupling a laser beam into the microscope such that it passes through the rear focal plane of the lens at a fixed point. The optical laser system has an offset lens movable along an axis of the laser beam path to move the laser beam focus in the direction of the optical axis. The optical laser system has a compensating lens arranged in the laser beam path and movable along the axis of the laser beam path. A controller and/or a mechanical coupling device carries out a movement of the compensating lens along the axis of the laser beam path when the lens is moved such that the laser beam continues to pass through the fixed point.

    LASER MICRODISSECTION DEVICE AND METHOD
    9.
    发明申请
    LASER MICRODISSECTION DEVICE AND METHOD 审中-公开
    激光微结构装置及方法

    公开(公告)号：US20140147884A1

    公开(公告)日：2014-05-29

    申请号：US13873284

    申请日：2013-04-30

    Applicant: LEICA MICROSYSTEMS CMS GMBH

    Inventor： Falk Schlaudraff ,  Christian Woditschka

    IPC: G01N1/44

    CPC classification number: G01N1/44 ,  G01N1/286 ,  G01N2001/2886

    Abstract: A laser microdissection device includes a microscope stage for carrying a specimen to be cut, a laser light source for generating a laser beam and a microscope objective for focusing the laser beam onto the specimen. An optical laser scanning device is configured to deflect the laser beam so as to move the laser beam focus in an X-Y direction perpendicular to a main axis of the microscope objective. The laser microdissection device also includes at least one of a Z displacement device configured to move the microscope stage in a Z direction, or an optical focus shifting device configured to move the focus of the laser beam in the Z direction. The Z displacement device and/or optical focus shifting device are controllable, together with the optical laser scanning device, so as to move the laser beam focus in the specimen along a three-dimensional cut line in an X-Y-Z direction.

    Abstract translation: 激光显微切割装置包括用于承载要切割的样品的显微镜载物台，用于产生激光束的激光源和用于将激光束聚焦到样本上的显微镜物镜。 光学激光扫描装置被配置为使激光束偏转，以使激光束聚焦沿与显微镜物镜的主轴垂直的X-Y方向移动。 激光显微切割装置还包括构造成在Z方向上移动显微镜载台的Z移位装置中的至少一个或被配置为沿Z方向移动激光束的焦点的光学移位装置中的至少一个。 Z位移装置和/或光学偏移装置与光学激光扫描装置一起是可控的，以沿着X-Y-Z方向的三维切割线移动样品中的激光束聚焦。

Patent Agency Ranking