公开(公告)号：US11085855B2

公开(公告)日：2021-08-10

申请号：US16310825

申请日：2017-06-27

Applicant: LEICA MICROSYSTEMS CMS GMBH

Inventor： Falk Schlaudraff ,  Andrew K. Lee

IPC: G01N1/28 ,  G01J1/42 ,  G02B21/08 ,  A61B18/20

Abstract: A method for performing a laser microdissection for cutting a dissectate from a specimen using a laser includes the step of providing the specimen in a light path of an illumination system. The specimen is illuminated by the illumination system. A detector detects light emanating from the specimen. The light detected by the detector is analyzed. It is determined, based on the analysis of the light detected by the detector, whether a receptacle for collecting the dissectate is disposed in a predetermined collection position, at which the dissectate is to be collected in the receptacle after it is cut from the specimen. Laser cutting of the dissectate from the specimen is initiated based on it having been determined that the receptacle is in the predetermined collection position.