发明授权
- 专利标题： Tin-plated copper terminal material, terminal, and wire terminal part structure
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申请号： US15774402申请日： 2016-11-24
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公开(公告)号： US11088472B2公开(公告)日： 2021-08-10
- 发明人: Kenji Kubota , Yoshie Tarutani , Kiyotaka Nakaya
- 申请人： MITSUBISHI MATERIALS CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： MITSUBISHI MATERIALS CORPORATION
- 当前专利权人： MITSUBISHI MATERIALS CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Locke Lord LLP
- 代理商 James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- 优先权： JPJP2015-232465 20151127,JPJP2016-066515 20160329
- 国际申请： PCT/JP2016/084690 WO 20161124
- 国际公布： WO2017/090638 WO 20170601
- 主分类号： H01R13/03
- IPC分类号： H01R13/03 ; H01R4/18 ; H01R4/62 ; C25D3/12 ; C25D3/22 ; C25D3/32
摘要：
On a base member made of copper or a copper alloy, a zinc-nickel alloy layer including zinc and nickel, and a tin layer made of tin alloy are laminated in this order: the zinc-nickel alloy layer has a thickness of 0.1-5 μm inclusive and has a nickel content of 5-50 mass % inclusive, the tin layer has a zinc concentration of 0.6-15 mass % inclusive, and, under an oxide layer which is the outermost layer, a metal zinc layer, having a zinc concentration of 5-40 at % inclusive and a thickness of 1-10 nm inclusive in SiO2 conversion, is formed on the tin layer.
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