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公开(公告)号：US11753733B2
公开(公告)日：2023-09-12
申请号：US16617574
申请日：2018-06-01
发明人： Yoshie Tarutani , Kenji Kubota , Kiyotaka Nakaya , Isao Arai
摘要： In a method for producing high-purity electrolytic copper, a first additive (A) containing an aromatic ring of a hydrophobic group and a polyoxyalkylene group of a hydrophilic group, a second additive (B) formed of polyvinyl alcohols, and a third additive (C) formed of tetrazoles are added to a copper electrolyte, copper electrolysis is performed by controlling each concentration of the first additive (A), the second additive (B), and the third additive (C), a current density and a bath temperature, and accordingly, electrolytic copper in which a concentration of Ag is less than 0.2 mass ppm, a concentration of S is less than 0.07 mass ppm, a concentration of all impurities is less than 0.2 mass ppm, and an area ratio of crystal grains having an average crystal grain misorientation (referred to as a GOS value) exceeding 2.5° is 10% or less is obtained.
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公开(公告)号：US20230257897A1
公开(公告)日：2023-08-17
申请号：US18012339
申请日：2021-06-16
发明人： Takashi Tamagawa , Kenji Kubota
摘要： A corrosion-resistant terminal material for an aluminum core wire having a good adhesion of plating and a high effect of corrosion resistant, having a base material in which at least a surface is made of copper or copper alloy and a corrosion-resistant film formed on at least a part of the base material; the corrosion film having an intermediate alloy layer made of tin alloy, a zinc layer made of zinc or zinc alloy formed on the intermediate alloy layer, and a tin-zinc alloy layer made of tin alloy containing zinc and formed on the zinc layer; and a tin content in the intermediate alloy layer is 90 at % or less.
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公开(公告)号：US11530490B2
公开(公告)日：2022-12-20
申请号：US16636056
申请日：2018-08-08
IPC分类号： H01B1/02 , B32B15/01 , H01R13/03 , C25D5/50 , C25D5/00 , C25D3/12 , C25D3/30 , C25D3/46 , C25D3/56 , C25D5/12 , C25D5/34 , C25D7/00
摘要： In a terminal material with a silver coating film including a silver layer on a surface, a terminal and a terminal material having high reliability are easily manufactured with low cost without a heat treatment. A base material formed of copper or a copper alloy; and nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order are included, the nickel layer has a thickness of 0.05 μm to 5.00 μm and is formed of nickel or a nickel alloy, the intermediate layer has a thickness of 0.02 μm to 1.00 μm and is an alloy layer containing silver (Ag) and a substance X, and the substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium.
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公开(公告)号：US11453953B2
公开(公告)日：2022-09-27
申请号：US16613209
申请日：2018-06-01
发明人： Yoshie Tarutani , Kenji Kubota , Kiyotaka Nakaya , Isao Arai
摘要： The present invention provides a high-purity electrolytic copper 10 having a Cu purity excluding gas components (O, F, S, C, and Cl) is 99.9999 mass % or more, a content of S is 0.1 mass ppm or less, and an area ratio of crystals having a (101)±10° orientation is less than 40%, when crystal orientation is measured by electron backscatter diffraction in a cross section along a thickness direction.
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公开(公告)号：US11211729B2
公开(公告)日：2021-12-28
申请号：US16481624
申请日：2018-01-29
发明人： Kenji Kubota , Yoshie Tarutani , Kiyotaka Nakaya
摘要： A terminal material for a connector terminal, using a copper or copper alloy substrate is crimped to an end of wire formed from an aluminum wire material; and a terminal using this terminal material: a zinc layer 4 that is formed of zinc or a zinc alloy and a tin layer 5 that is formed of tin or a tin alloy are sequentially laminated in this order on a substrate 2 that is formed of copper or a copper alloy: with respect to the zinc layer and the tin layer, the adhesion amount of tin contained in the whole layers is from 0.5 mg/cm2 to 7.0 mg/cm2 (inclusive) and the adhesion amount of zinc contained in the whole layers is from 0.07 mg/cm2 to 2.0 mg/cm2 (inclusive), and the content percentage of zinc in the vicinity of the surface is from 0.2% by mass to 10.0% by mass (inclusive).
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公开(公告)号：US20210158990A1
公开(公告)日：2021-05-27
申请号：US16636056
申请日：2018-08-08
摘要： In a terminal material with a silver coating film including a silver layer on a surface, a terminal and a terminal material having high reliability are easily manufactured with low cost without a heat treatment. A base material formed of copper or a copper alloy; and nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order are included, the nickel layer has a thickness of 0.05 μm to 5.00 μm and is formed of nickel or a nickel alloy, the intermediate layer has a thickness of 0.02 μm to 1.00 μm and is an alloy layer containing silver (Ag) and a substance X, and the substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium.
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公开(公告)号：US20190386415A1
公开(公告)日：2019-12-19
申请号：US16481624
申请日：2018-01-29
发明人： Kenji Kubota , Yoshie Tarutani , Kiyotaka Nakaya
摘要： A terminal material for a connector terminal, using a copper or copper alloy substrate is crimped to an end of wire formed from an aluminum wire material; and a terminal using this terminal material: a zinc layer 4 that is formed of zinc or a zinc alloy and a tin layer 5 that is formed of tin or a tin alloy are sequentially laminated in this order on a substrate 2 that is formed of copper or a copper alloy: with respect to the zinc layer and the tin layer, the adhesion amount of tin contained in the whole layers is from 0.5 mg/cm2 to 7.0 mg/cm2 (inclusive) and the adhesion amount of zinc contained in the whole layers is from 0.07 mg/cm2 to 2.0 mg/cm2 (inclusive), and the content percentage of zinc in the vicinity of the surface is from 0.2% by mass to 10.0% by mass (inclusive).
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公开(公告)号：US20170088963A1
公开(公告)日：2017-03-30
申请号：US15277508
申请日：2016-09-27
发明人： Yoshie Tarutani , Kenji Kubota , Kiyotaka Nakaya
IPC分类号： C25C1/12
CPC分类号： C25C1/12
摘要： The present invention provides an additive for high-purity copper electrolytic refining, a method of producing high-purity copper, and a high-purity electrolytic copper. This additive of the present invention for high-purity copper electrolytic refining can be added to a copper electrolyte in copper electrolytic refining. The additive includes a silver and chlorine reducing agent of electrolytic copper which is formed of tetrazoles which is one of a tetrazole and a tetrazole derivative.
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9.发明公开公开(公告)号：US20240178115A1
公开(公告)日：2024-05-30
申请号：US18283519
申请日：2022-03-23
发明人： Marina Sakamaki , Kenji Kubota , Toyo Ohashi
IPC分类号： H01L23/498 , B32B3/30 , B32B15/08 , B32B15/20 , C25D3/38 , C25D5/00 , C25D5/18 , H01L21/48 , H01L23/00
CPC分类号： H01L23/49822 , B32B3/30 , B32B15/08 , B32B15/20 , C25D3/38 , C25D5/18 , C25D5/605 , C25D5/617 , H01L21/4857 , B32B2250/02 , B32B2255/06 , B32B2255/205 , B32B2307/202 , B32B2307/206 , B32B2457/08 , H01L24/29 , H01L24/32 , H01L2224/29109 , H01L2224/29111 , H01L2224/29139 , H01L2224/29147 , H01L2224/32227 , H01L2924/014
摘要： This metal sheet material is made of copper or a copper alloy, and includes a main sheet body and a roughened plating layer that is formed on an outermost surface layer of the main sheet body. An engagement protrusion that protrudes toward the opposite side to the main sheet body and has a widening portion that gradually widens in width toward a tip end side in a protrusion direction is formed in the roughened plating layer. In a cross section of the main sheet body along the thickness direction, a plurality of the engagement protrusions are formed on a surface crystal grain that is located on the outermost surface of the main sheet body.
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公开(公告)号：US11781234B2
公开(公告)日：2023-10-10
申请号：US17416551
申请日：2019-12-18
发明人： Naoki Miyashima , Kazunari Maki , Shinichi Funaki , Kenji Kubota
CPC分类号： C25D5/10 , C22C9/00 , C25D5/505 , Y10T428/12903
摘要： A copper alloy plate including 0.3 mass % or more and 1.2 mass % or less of Mg, 0.001 mass % or more and 0.2 mass % or less of P, and the balance Cu with inevitable impurities in a thickness center portion in a plate thickness direction; Mg concentration on a plate surface is 30% or less of bulk Mg concentration at the thickness center portion; a surface layer part having a depth from the plate surface to where it is 90% of the bulk Mg concentration is provided; and in the surface layer part, the Mg concentration increases from the plate surface toward the thickness center portion with a concentration gradient 1.8 mass %/μm or more and 50 mass %/μm or less.
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