- 专利标题: Method for no-silane electroless metal deposition using high adhesive catalyst and product therefrom
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申请号: US16565824申请日: 2019-09-10
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公开(公告)号: US11098407B2公开(公告)日: 2021-08-24
- 发明人: Chin-Wei Hsu , Wei-Yen Wang , Tzu-Chien Wei
- 申请人: NATIONAL TSING HUA UNIVERSITY
- 申请人地址: TW Hsinchu
- 专利权人: NATIONAL TSING HUA UNIVERSITY
- 当前专利权人: NATIONAL TSING HUA UNIVERSITY
- 当前专利权人地址: TW Hsinchu
- 代理机构: Li & Cai Intellectual Property (USA) Office
- 优先权: TW104131105 20150921,TW105129633 20160912
- 主分类号: C23C18/18
- IPC分类号: C23C18/18 ; C23C18/38 ; C23C18/32 ; B01J35/02 ; B01J33/00 ; B01J23/44 ; B01J37/02 ; C23C18/16
摘要:
A method for electroless metal deposition and an electroless metal layer included substrate are provided. The method for electroless metal deposition includes steps as follows. a) cleaning a substrate, applying a hydrofluoric acid onto the substrate; and then applying a modifying agent onto the substrate to form a chemical oxide layer on the substrate; b) a catalyst layer is formed on the chemical oxide layer, wherein, the catalyst layer includes a plurality of colloidal nanoparticles, and each of the plurality of colloidal nanoparticles includes a palladium nanoparticle and a polymer which encapsulates the palladium nanoparticle, and c) depositing a metal on the catalyst layer through an electroless metal deposition to form an electroless metal layer.
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