Invention Grant
- Patent Title: Method of manufacturing circuit board structure
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Application No.: US16540038Application Date: 2019-08-13
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Publication No.: US11114782B2Publication Date: 2021-09-07
- Inventor: Tzyy-Jang Tseng , Pei-Wei Wang , Ching-Ho Hsieh , Shao-Chien Lee , Kuo-Wei Li
- Applicant: Unimicron Technology Corp.
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: CKC & Partners Co., LLC
- Priority: TW108116615 20190514
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01R12/62 ; H05K1/14 ; H05K1/11 ; H05K1/03 ; H05K3/00 ; H05K3/40 ; H05K3/46

Abstract:
A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.
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