公开(公告)号：US11737209B2

公开(公告)日：2023-08-22

申请号：US17574551

申请日：2022-01-13

Applicant: Unimicron Technology Corp.

Inventor： Chih-Chiang Lu ,  Chi-Min Chang ,  Shao-Chien Lee ,  Jun-Rui Huang ,  Ming-Ting Chang

IPC: H05K1/02 ,  H05K3/42 ,  H05K3/46 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10

CPC classification number: H05K1/024 ,  H05K1/115 ,  H05K3/0011 ,  H05K3/10 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/0183 ,  H05K2201/09209 ,  H05K2203/0502

Abstract: A circuit board includes a first dielectric material, a second dielectric material, a third dielectric material, a first external circuit layer, a second external circuit layer, multiple conductive structures, and a conductive via structure. Dielectric constants of the first, the second and the third dielectric materials are different. The first and the second external circuit layers are respectively disposed on the first and the third dielectric materials. The conductive via structure at least penetrates the first and the second dielectric materials and is electrically connected to the first and the second external circuit layers to define a signal path. The conductive structures are electrically connected to each other and surround the first, the second and the third dielectric materials. The conductive structures are electrically connected to the first and the second external circuit layers to define a ground path surrounding the signal path.

公开(公告)号：US11600936B2

公开(公告)日：2023-03-07

申请号：US17322906

申请日：2021-05-18

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Pei-Wei Wang ,  Ching-Ho Hsieh ,  Shao-Chien Lee ,  Kuo-Wei Li

IPC: H05K1/14 ,  H01R12/62 ,  H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

公开(公告)号：US12052815B2

公开(公告)日：2024-07-30

申请号：US18447265

申请日：2023-08-09

Applicant: Unimicron Technology Corp.

Inventor： Chih-Chiang Lu ,  Heng-Ming Nien ,  Ching-Sheng Chen ,  Ching Chang ,  Ming-Ting Chang ,  Chi-Min Chang ,  Shao-Chien Lee ,  Jun-Rui Huang ,  Shih-Lian Cheng

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  H05K3/24 ,  H05K3/42 ,  H05K3/46 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/0222 ,  H05K1/113 ,  H05K1/119 ,  H05K3/429 ,  H05K3/462 ,  H05K1/181 ,  H05K3/0094 ,  H05K3/24 ,  H05K2201/10734

Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.

公开(公告)号：US20230389172A1

公开(公告)日：2023-11-30

申请号：US18447265

申请日：2023-08-09

Applicant: Unimicron Technology Corp.

Inventor： Chih-Chiang Lu ,  Heng-Ming Nien ,  Ching-Sheng Chen ,  Ching Chang ,  Ming-Ting Chang ,  Chi-Min Chang ,  Shao-Chien Lee ,  Jun-Rui Huang ,  Shih-Lian Cheng

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/42

CPC classification number: H05K1/0222 ,  H05K1/113 ,  H05K1/119 ,  H05K3/462 ,  H05K3/429 ,  H05K3/24

Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.

公开(公告)号：US11785707B2

公开(公告)日：2023-10-10

申请号：US17496791

申请日：2021-10-08

Applicant: Unimicron Technology Corp.

Inventor： Chih-Chiang Lu ,  Heng-Ming Nien ,  Ching-Sheng Chen ,  Ching Chang ,  Ming-Ting Chang ,  Chi-Min Chang ,  Shao-Chien Lee ,  Jun-Rui Huang ,  Shih-Lian Cheng

IPC: H05K1/02 ,  H05K1/16 ,  H05K3/24 ,  H05K3/42 ,  H05K3/46 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/0222 ,  H05K1/113 ,  H05K1/119 ,  H05K3/429 ,  H05K3/462 ,  H05K1/181 ,  H05K3/0094 ,  H05K3/24 ,  H05K2201/10734

Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.

公开(公告)号：US11641720B2

公开(公告)日：2023-05-02

申请号：US17224078

申请日：2021-04-06

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei Wang ,  Shao-Chien Lee ,  Ra-Min Tain ,  Chi-Chun Po ,  Po-Hsiang Wang ,  Pei-Chang Huang ,  Chin-Min Hu

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/34

Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.

公开(公告)号：US10939538B1

公开(公告)日：2021-03-02

申请号：US16907298

申请日：2020-06-21

Applicant: Unimicron Technology Corp.

Inventor： Ming-Hao Wu ,  Shao-Chien Lee

IPC: H05K1/02

Abstract: A circuit board structure includes a circuit board, at least a through hole, and at least a heat dissipating structure. The circuit board has two opposite surfaces. A metal layer is disposed on each of the opposite surfaces of the circuit board. The through hole is disposed in the circuit board, and the through hole penetrates through the circuit board. The heat dissipating structure is disposed in the through hole. The heat dissipating structure includes a first metal block and a second metal block. The first metal block and the second metal block are joined together in the through hole and have an interface.

公开(公告)号：US11991824B2

公开(公告)日：2024-05-21

申请号：US17448893

申请日：2021-09-26

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Cheng-Ta Ko ,  Pu-Ju Lin ,  Chi-Hai Kuo ,  Shao-Chien Lee ,  Ming-Ru Chen ,  Cheng-Chung Lo

IPC: H05K1/02 ,  G02F1/1333 ,  G02F1/1368 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H10K59/12 ,  H10K59/123 ,  H10K59/124 ,  H10K59/131

CPC classification number: H05K1/115 ,  H05K1/0306 ,  H05K3/0067 ,  H05K3/0094

Abstract: A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first, second and third sub-circuit boards are electrically connected to one another.

公开(公告)号：US20220071000A1

公开(公告)日：2022-03-03

申请号：US17149664

申请日：2021-01-14

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Shao-Chien Lee ,  John Hon-Shing Lau ,  Chen-Hua Cheng ,  Ra-Min Tain

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/02 ,  H05K3/00

Abstract: The disclosure provides a circuit board structure including at least two sub-circuit boards and at least one connector. Each of the sub-circuit boards includes a plurality of carrier units. The connector is connected between the sub-circuit boards, and a plurality of stress-relaxation gaps are defined between the sub-circuit boards.

公开(公告)号：US11114782B2

公开(公告)日：2021-09-07

申请号：US16540038

申请日：2019-08-13

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Pei-Wei Wang ,  Ching-Ho Hsieh ,  Shao-Chien Lee ,  Kuo-Wei Li

IPC: H05K1/02 ,  H01R12/62 ,  H05K1/14 ,  H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.