An object of the present invention is to provide an acrylic resin powder suitable for hot melt adhesives which dissolves in polyol components such as polyalkylene glycols faster than conventional ones, as well as a resin composition which can be produced with lower energy than conventional ones. The object is achieved by using an acrylic resin powder comprising: a copolymer which contains a methyl methacrylate unit, wherein a volume average particle size of a primary particle is 0.1 to 10 μm, a volume average particle size of a secondary particle is 20 to 80 μm, a weight average molecular weight is 10,000 to 500,000, and the acrylic resin powder is soluble in polypropylene glycol having a weight average molecular weight of 1000 under stirring at a concentration of 10% by mass at 60° C. for 60 minutes.