Invention Grant
- Patent Title: Method to selectively pattern a surface for plasma resistant coat applications
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Application No.: US15883787Application Date: 2018-01-30
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Publication No.: US11124659B2Publication Date: 2021-09-21
- Inventor: Amir A. Yasseri , Duane Outka , Hong Shih , John Daugherty
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Beyer Law Group LLP
- Main IPC: B05D1/32
- IPC: B05D1/32 ; C09D5/00 ; C09D1/00 ; C01G25/02 ; C23C4/02 ; C23C4/12 ; C23C4/01 ; C01F7/02 ; C23C4/18 ; C23C4/10 ; C23C4/11
Abstract:
A method for providing a part with a plasma resistant ceramic coating for use in a plasma processing chamber is provided. A patterned mask is placed on the part. A film is deposited over the part. The patterned mask is removed. A plasma resistant ceramic coating is applied on the part.
Public/Granted literature
- US20190233658A1 METHOD TO SELECTIVELY PATTERN A SURFACE FOR PLASMA RESISTANT COAT APPLICATIONS Public/Granted day:2019-08-01
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