Invention Grant
- Patent Title: Post chemical mechanical polishing cleaning compositions
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Application No.: US16689850Application Date: 2019-11-20
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Publication No.: US11124740B2Publication Date: 2021-09-21
- Inventor: Atanu K. Das , Michael White , Daniela White
- Applicant: ENTEGRIS, INC.
- Applicant Address: US MA Billerica
- Assignee: ENTEGRIS, INC.
- Current Assignee: ENTEGRIS, INC.
- Current Assignee Address: US MA Billerica
- Agency: Entegris, Inc.
- Main IPC: C11D7/32
- IPC: C11D7/32 ; C11D3/28 ; C11D1/72 ; H01L21/02 ; C11D3/36 ; C11D3/30
Abstract:
A removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and ceria particles from a microelectronic device having said particles and contaminants thereon. The composition achieves highly efficacious removal of the ceria particles and CMP by-product contaminant material from the surface of the microelectronic device without compromising the low-k dielectric, silicon nitride, or tungsten-containing materials.
Public/Granted literature
- US20200181535A1 POST CHEMICAL MECHANICAL POLISHING CLEANING COMPOSITIONS Public/Granted day:2020-06-11
Information query
