SURFACE MODIFIED SUBSTRATES AND RELATED METHODS

    公开(公告)号:US20250034700A1

    公开(公告)日:2025-01-30

    申请号:US18785339

    申请日:2024-07-26

    Applicant: ENTEGRIS, INC.

    Abstract: Surface modified substrates and related methods are provided. A substrate having a modified surface comprises a first region and a second region. The first region is located above the second region. The first region comprises a nickel fluoride. The second region comprises a nickel alloy. A concentration of the nickel fluoride gradually decreases from the first region to the second region.

    Vapor deposition precursor compounds and process of use

    公开(公告)号:US12209105B2

    公开(公告)日:2025-01-28

    申请号:US17901569

    申请日:2022-09-01

    Applicant: ENTEGRIS, INC.

    Abstract: Provided is a plasma enhanced atomic layer deposition (PEALD) process for depositing etch-resistant SiOCN films. These films provide improved growth rate, improved step coverage and excellent etch resistance to wet etchants and post-deposition plasma treatments containing O2 and NH3 co-reactants. This PEALD process relies on one or more precursors reacting in tandem with the plasma exposure to deposit the etch-resistant thin-films of SiOCN. The films display excellent resistance to wet etching with dilute aqueous HF solutions, both after deposition and after post-deposition plasma treatment(s). Accordingly, these films are expected to display excellent stability towards post-deposition fabrication steps utilized during device manufacturing and build.

    PROCESS FOR PREPARING ORGANOTIN COMPOUNDS

    公开(公告)号:US20250002509A1

    公开(公告)日:2025-01-02

    申请号:US18884024

    申请日:2024-09-12

    Applicant: ENTEGRIS, INC.

    Abstract: The invention provides a facile process for preparing certain organotin compounds having alkyl and aryl substituents. These compounds are useful as intermediates in the synthesis of certain alkylamino- and alkoxy-substituted alkyl tin compounds, which are in turn useful as precursors in the deposition of high-purity tin oxide films in, for example, extreme ultraviolet light (EUV) lithography techniques used in microelectronic device manufacturing.

    SELECTIVE RUTHENIUM DEPOSITION AND RELATED SYSTEMS AND METHODS

    公开(公告)号:US20240412981A1

    公开(公告)日:2024-12-12

    申请号:US18737743

    申请日:2024-06-07

    Applicant: ENTEGRIS, INC.

    Abstract: Selective ruthenium deposition and related systems and methods are provided. A method comprises vaporizing at least a portion of a ruthenium precursor to produce a vaporized ruthenium precursor; contacting a first surface portion and a second surface portion of a substrate with the vaporized ruthenium precursor and at least one reducing gas; and depositing ruthenium on the first surface portion of the substrate with a selectivity of at least 25 Å relative to the second surface portion of the substrate. A device comprises a substrate having a first surface portion and a second surface portion adjacent to the first surface portion; and a ruthenium layer located on the first surface portion of the substrate, wherein the ruthenium layer has a thickness of at least 25 Å on the first surface portion of the substrate; wherein the second surface portion of the substrate does not comprise ruthenium.

    OPTICAL PARTICLE COUNTER AND METHODS

    公开(公告)号:US20240410812A1

    公开(公告)日:2024-12-12

    申请号:US18732519

    申请日:2024-06-03

    Applicant: ENTEGRIS, INC.

    Inventor: Michael Manfred

    Abstract: This description relates to optical particle counters, methods of using optical particle counters, and methods of reducing particle count errors during use of an optical particle counter. The method includes placing an optical isolator between the laser and the flow cell to allow laser light to pass into the flow cell, and to reduce the intensity of light re-directed back into the laser as optical feedback capable of causing mode hopping.

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