- Patent Title: Method for manufacturing a semiconductor die provided with a filtering module, semiconductor die including the filtering module, package housing the semiconductor die, and electronic system
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Application No.: US16256816Application Date: 2019-01-24
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Publication No.: US11128958B2Publication Date: 2021-09-21
- Inventor: Giorgio Allegato , Federico Vercesi , Laura Maria Castoldi , Laura Oggioni , Matteo Perletti
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed IP Law Group LLP
- Priority: IT102018000002049 20180126
- Main IPC: H04R19/04
- IPC: H04R19/04 ; B81C1/00 ; H04R1/08 ; H04R19/00 ; H04R1/02 ; H04R31/00

Abstract:
A method for manufacturing a semiconductor die, comprising the steps of: providing a MEMS device having a structural body, provided with a cavity, and a membrane structure suspended over the cavity; coupling the structural body to a filtering module via direct bonding or fusion bonding so that a first portion of the filtering module extends over the cavity and a second portion of the filtering module extends seamlessly as a prolongation of the structural body; and etching selective portions of the filtering module in an area corresponding to the first portion, to form filtering openings fluidically coupled to the cavity. The semiconductor die is, for example, a microphone.
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