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公开(公告)号：US11274036B2
公开(公告)日：2022-03-15
申请号：US16815883
申请日：2020-03-11
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giorgio Allegato , Barbara Simoni , Carlo Valzasina , Lorenzo Corso
Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.
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2.发明授权公开(公告)号：US10329141B2
公开(公告)日：2019-06-25
申请号：US15083034
申请日：2016-03-28
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Alessandro Tocchio , Carlo Valzasina , Luca Guerinoni , Giorgio Allegato
IPC: H01L23/13 , B81B7/00 , B81C1/00 , H01L23/055 , H01L23/16
Abstract: An encapsulated device of semiconductor material wherein a chip of semiconductor material is fixed to a base element of a packaging body through at least one pillar element having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements are fixed in proximity of the corners of a fixing surface of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.
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公开(公告)号：US11865581B2
公开(公告)日：2024-01-09
申请号：US16684289
申请日：2019-11-14
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Gabriele Gattere , Carlo Valzasina , Federico Vercesi , Giorgio Allegato
CPC classification number: B06B1/0681 , B06B1/0666 , B81B7/0016 , B81C1/00825 , B81B2201/0264 , B81B2201/0271 , B81B2203/0127 , B81B2203/0163
Abstract: An ultrasonic MEMS acoustic transducer formed in a body of semiconductor material having first and second surfaces opposite to one another. A first cavity extends in the body and delimits at the bottom a sensitive portion, which extends between the first cavity and the first surface of the body. The sensitive portion houses a second cavity and forms a membrane that extends between the second cavity and the first surface of the body. An elastic supporting structure extends between the sensitive portion and the body and is suspended over the first cavity.
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公开(公告)号：US10555091B2
公开(公告)日：2020-02-04
申请号：US16128288
申请日：2018-09-11
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Matteo Perletti , Federico Vercesi , Silvia Adorno , Giorgio Allegato
Abstract: A method for manufacturing a filtering module comprising the steps of: forming a multilayer body comprising a filter layer of semiconductor material and having a thickness of less than 10 μm, a first structural layer coupled to a first side of the filter layer, and a second structural layer coupled to a second side, opposite to the first side, of the filter layer; forming a recess in the first structural layer, which extends throughout its thickness; removing selective portions, exposed through the recess, of the filter layer to form a plurality of openings, which extend throughout the thickness of the filter layer; and completely removing the second structural layer to connect fluidically the first and second sides of the filter layer, thus forming a filtering membrane designed to inhibit passage of contaminating particles.
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公开(公告)号：US20180059405A1
公开(公告)日：2018-03-01
申请号：US15245805
申请日：2016-08-24
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio Allegato , Sonia Costantini , Federico Vercesi , Roberto Carminati
CPC classification number: G02B26/105 , B81B2201/042 , B81C1/00317 , B81C2203/0109 , B81C2203/019 , G02B26/0833
Abstract: Disclosed herein is a micro-electro mechanical (MEMS) device including a substrate, and a MEMS mirror stack on the substrate. A first bonding layer seals against ingress of environmental contaminants and mechanically anchors the MEMS mirror stack to the substrate. A cap layer is formed on the MEMS mirror stack. A second boding layer seals against ingress of environmental contaminants and mechanically anchors the cap layer to the MEMS mirror stack.
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Patent Agency Ranking
6.发明授权Method for manufacturing a die assembly having a small thickness and die assembly relating thereto 有权具有小厚度的模具组件的制造方法和与其相关的模具组件公开(公告)号：US09327964B2
公开(公告)日：2016-05-03
申请号：US14524661
申请日：2014-10-27
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio Allegato , Marco Ferrera , Matteo Garavaglia , Lorenzo Corso
CPC classification number: B81B7/0074 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/097 , B81C1/00238 , B81C1/00325 , B81C2203/0118 , B81C2203/0792
Abstract: A method for manufacturing a die assembly, including the steps of: bonding a first wafer of semiconductor material to a second wafer, the second wafer including a respective semiconductor body having a respective initial thickness and forming an integrated electronic circuit; and subsequently reducing the initial thickness of the semiconductor body of the second wafer; and subsequently bonding the second wafer to a third wafer, the third wafer forming a micro-electromechanical sensing structure.
Abstract translation: 一种用于制造模具组件的方法，包括以下步骤：将半导体材料的第一晶片接合到第二晶片，所述第二晶片包括具有各自的初始厚度的相应的半导体本体，并形成集成的电子电路; 随后减小第二晶片的半导体本体的初始厚度; 并且随后将所述第二晶片接合到第三晶片，所述第三晶片形成微机电感测结构。
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7.发明申请METHOD FOR MANUFACTURING A DIE ASSEMBLY HAVING A SMALL THICKNESS AND DIE ASSEMBLY RELATING THERETO 有权用于制造具有小厚度的模具组件的方法和与其相关的模具组件公开(公告)号：US20150115378A1
公开(公告)日：2015-04-30
申请号：US14524661
申请日：2014-10-27
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio Allegato , Marco Ferrera , Matteo Garavaglia , Lorenzo Corso
CPC classification number: B81B7/0074 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/097 , B81C1/00238 , B81C1/00325 , B81C2203/0118 , B81C2203/0792
Abstract: A method for manufacturing a die assembly, including the steps of: bonding a first wafer of semiconductor material to a second wafer, the second wafer including a respective semiconductor body having a respective initial thickness and forming an integrated electronic circuit; and subsequently reducing the initial thickness of the semiconductor body of the second wafer; and subsequently bonding the second wafer to a third wafer, the third wafer forming a micro-electromechanical sensing structure.
Abstract translation: 一种用于制造模具组件的方法，包括以下步骤：将半导体材料的第一晶片接合到第二晶片，所述第二晶片包括具有各自的初始厚度的相应的半导体本体，并形成集成的电子电路; 随后减小第二晶片的半导体本体的初始厚度; 并且随后将所述第二晶片接合到第三晶片，所述第三晶片形成微机电感测结构。
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公开(公告)号：US11969757B2
公开(公告)日：2024-04-30
申请号：US17191475
申请日：2021-03-03
Applicant: STMicroelectronics S.r.l.
Inventor： Federico Vercesi , Alessandro Danei , Giorgio Allegato , Gabriele Gattere , Roberto Campedelli
CPC classification number: B06B1/0666 , H10N30/01
Abstract: A method for manufacturing a PMUT device including a piezoelectric element located at a membrane element is provided. The method includes receiving a silicon on insulator substrate having a first silicon layer, an oxide layer, and a second silicon layer. Portions of a first surface of the second silicon layer are exposed by removing exposed side portions of the first silicon layer and corresponding portions of the oxide layer, and a central portion including the remaining portions of the first silicon layer and of the oxide layer is defined. Anchor portions for the membrane element are formed at the exposed portions of the first surface of the second silicon layer. The piezoelectric element is formed above the central portion, and the membrane element is defined by selectively removing the second layer and removing the remaining portion of the oxide from under the remaining portion of the first silicon layer.
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公开(公告)号：US11675186B2
公开(公告)日：2023-06-13
申请号：US16591854
申请日：2019-10-03
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio Allegato , Sonia Costantini , Federico Vercesi , Roberto Carminati
CPC classification number: G02B26/105 , B81C1/00317 , B81C1/00523 , G02B26/0833 , B81B2201/042 , B81C2203/0109 , B81C2203/019
Abstract: A method for making a micro-electro mechanical (MEMS) device includes forming a MEMS mirror stack on a handle layer, and applying a first bonding layer to the MEMS mirror stack. The method continues with disposing a substrate on the first bonding layer such that the MEMS mirror stack is mechanically anchored to the substrate and so as to seal against ingress of environmental contaminants, removing the handle layer, and applying a second bonding layer to the MEMS mirror stack. A cap layer is disposed on the second bonding layer such that the cap layer is mechanically anchored to the MEMS mirror stack and so as to seal against ingress of environmental contaminants.
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10.发明授权公开(公告)号：US10227233B2
公开(公告)日：2019-03-12
申请号：US15379091
申请日：2016-12-14
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giorgio Allegato , Laura Oggioni , Matteo Garavaglia , Roberto Somaschini
Abstract: A microelectromechanical device having a first substrate of semiconductor material and a second substrate of semiconductor material having a bonding recess delimited by projecting portions, monolithic therewith. The bonding recess forms a closed cavity with the first substrate. A bonding structure is arranged within the closed cavity and is bonded to the first and second substrates. A microelectromechanical structure is formed in a substrate chosen between the first and second substrates. The device is manufactured by forming the bonding recess in a first wafer; depositing a bonding mass in the bonding recess, the bonding mass having a greater depth than the bonding recess; and bonding the two wafers.
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