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公开(公告)号：US11051113B2
公开(公告)日：2021-06-29
申请号：US16813477
申请日：2020-03-09
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Fabrizio Cerini , Silvia Adorno , Federico Vercesi
IPC: H04R17/02 , B81B3/00 , B81C1/00 , H01L41/113
Abstract: A piezoelectric MEMS transducer formed in a body of semiconductor material, which has a central axis and a peripheral area and comprises a plurality of beams, transverse to the central axis and having a first end, coupled to the peripheral area of the body, and a second end, facing the central axis; a membrane, transverse to the central axis and arranged underneath the plurality of beams; and a pillar, parallel to the central axis and rigid with the second end of the beams and to the membrane. The MEMS transducer further comprises a plurality of piezoelectric sensing elements arranged on the plurality of beams.
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公开(公告)号：US12078799B2
公开(公告)日：2024-09-03
申请号：US18206363
申请日：2023-06-06
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio Allegato , Sonia Costantini , Federico Vercesi , Roberto Carminati
CPC classification number: G02B26/105 , B81C1/00317 , B81C1/00523 , G02B26/0833 , B81B2201/042 , B81C2203/0109 , B81C2203/019
Abstract: A method of making a MEMS device including forming a mirror stack on a handle layer, applying a first bonding layer to the mirror stack, and disposing a substrate on the first bonding layer. The handle layer is removed and a second bonding layer is applied. A cap layer is disposed on the second bonding layer. The mirror stack is formed by disposing a silicon layer on the handle layer, disposing a first insulating layer on the silicon layer, etching portions of the first insulating layer, and depositing a first conductive layer on the first insulating layer. The formation also includes depositing a second insulating layer on the first conductive layer, a portion of the second insulating layer to expose a portion of the first conductive layer exposed, and forming a conductive pad on the exposed portion of the first conductive layer.
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公开(公告)号：US11128958B2
公开(公告)日：2021-09-21
申请号：US16256816
申请日：2019-01-24
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giorgio Allegato , Federico Vercesi , Laura Maria Castoldi , Laura Oggioni , Matteo Perletti
Abstract: A method for manufacturing a semiconductor die, comprising the steps of: providing a MEMS device having a structural body, provided with a cavity, and a membrane structure suspended over the cavity; coupling the structural body to a filtering module via direct bonding or fusion bonding so that a first portion of the filtering module extends over the cavity and a second portion of the filtering module extends seamlessly as a prolongation of the structural body; and etching selective portions of the filtering module in an area corresponding to the first portion, to form filtering openings fluidically coupled to the cavity. The semiconductor die is, for example, a microphone.
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4.发明授权公开(公告)号：US11855604B2
公开(公告)日：2023-12-26
申请号：US17031181
申请日：2020-09-24
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Federico Vercesi , Lorenzo Corso , Giorgio Allegato , Gabriele Gattere
CPC classification number: H03H9/1021 , B81B7/0038 , B81C1/00285 , H03H3/02 , H03H9/17 , B81B2201/0271 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C2201/0105 , B81C2203/0118 , H03H2003/022 , H03H2003/027 , H03H2009/155
Abstract: A microelectromechanical resonator device has: a main body, with a first surface and a second surface, opposite to one another along a vertical axis, and made of a first layer and a second layer, arranged on the first layer; a cap, having a respective first surface and a respective second surface, opposite to one another along the vertical axis, and coupled to the main body by bonding elements; and a piezoelectric resonator structure formed by: a mobile element, constituted by a resonator portion of the first layer, suspended in cantilever fashion with respect to an internal cavity provided in the second layer and moreover, on the opposite side, with respect to a housing cavity provided in the cap; a region of piezoelectric material, arranged on the mobile element on the first surface of the main body; and a top electrode, arranged on the region of piezoelectric material, the mobile element constituting a bottom electrode of the piezoelectric resonator structure.
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公开(公告)号：US11317219B2
公开(公告)日：2022-04-26
申请号：US16693003
申请日：2019-11-22
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Matteo Perletti , Federico Vercesi , Silvia Adorno , Giorgio Allegato
Abstract: A method for manufacturing a filtering module comprising the steps of: forming a multilayer body comprising a filter layer of semiconductor material and having a thickness of less than 10 μm, a first structural layer coupled to a first side of the filter layer, and a second structural layer coupled to a second side, opposite to the first side, of the filter layer; forming a recess in the first structural layer, which extends throughout its thickness; removing selective portions, exposed through the recess, of the filter layer to form a plurality of openings, which extend throughout the thickness of the filter layer; and completely removing the second structural layer to connect fluidically the first and second sides of the filter layer, thus forming a filtering membrane designed to inhibit passage of contaminating particles.
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Patent Agency Ranking
公开(公告)号：US10473920B2
公开(公告)日：2019-11-12
申请号：US15245805
申请日：2016-08-24
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio Allegato , Sonia Costantini , Federico Vercesi , Roberto Carminati
Abstract: Disclosed herein is a micro-electro mechanical (MEMS) device including a substrate, and a MEMS mirror stack on the substrate. A first bonding layer seals against ingress of environmental contaminants and mechanically anchors the MEMS mirror stack to the substrate. A cap layer is formed on the MEMS mirror stack. A second boding layer seals against ingress of environmental contaminants and mechanically anchors the cap layer to the MEMS mirror stack.
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公开(公告)号：US11969757B2
公开(公告)日：2024-04-30
申请号：US17191475
申请日：2021-03-03
Applicant: STMicroelectronics S.r.l.
Inventor： Federico Vercesi , Alessandro Danei , Giorgio Allegato , Gabriele Gattere , Roberto Campedelli
CPC classification number: B06B1/0666 , H10N30/01
Abstract: A method for manufacturing a PMUT device including a piezoelectric element located at a membrane element is provided. The method includes receiving a silicon on insulator substrate having a first silicon layer, an oxide layer, and a second silicon layer. Portions of a first surface of the second silicon layer are exposed by removing exposed side portions of the first silicon layer and corresponding portions of the oxide layer, and a central portion including the remaining portions of the first silicon layer and of the oxide layer is defined. Anchor portions for the membrane element are formed at the exposed portions of the first surface of the second silicon layer. The piezoelectric element is formed above the central portion, and the membrane element is defined by selectively removing the second layer and removing the remaining portion of the oxide from under the remaining portion of the first silicon layer.
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公开(公告)号：US11839159B2
公开(公告)日：2023-12-05
申请号：US17070548
申请日：2020-10-14
Applicant: STMicroelectronics S.r.l.
Inventor： Luca Seghizzi , Federico Vercesi , Claudia Pedrini
IPC: H01L41/083 , H10N30/50 , H10N30/03 , H10N30/09 , H10N30/30
CPC classification number: H10N30/50 , H10N30/03 , H10N30/09 , H10N30/306
Abstract: A transducer includes a supporting body and a suspended structure mechanically coupled to the supporting body. The suspended structure has a first and a second surface opposite to one another along an axis, and is configured to oscillate in an oscillation direction having at least one component parallel to the axis. A first piezoelectric transducer is disposed on the first surface of the suspended structure, and a second piezoelectric transducer is disposed on the second surface of the suspended structure.
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公开(公告)号：US11675186B2
公开(公告)日：2023-06-13
申请号：US16591854
申请日：2019-10-03
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio Allegato , Sonia Costantini , Federico Vercesi , Roberto Carminati
CPC classification number: G02B26/105 , B81C1/00317 , B81C1/00523 , G02B26/0833 , B81B2201/042 , B81C2203/0109 , B81C2203/019
Abstract: A method for making a micro-electro mechanical (MEMS) device includes forming a MEMS mirror stack on a handle layer, and applying a first bonding layer to the MEMS mirror stack. The method continues with disposing a substrate on the first bonding layer such that the MEMS mirror stack is mechanically anchored to the substrate and so as to seal against ingress of environmental contaminants, removing the handle layer, and applying a second bonding layer to the MEMS mirror stack. A cap layer is disposed on the second bonding layer such that the cap layer is mechanically anchored to the MEMS mirror stack and so as to seal against ingress of environmental contaminants.
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10.发明授权公开(公告)号：US11865581B2
公开(公告)日：2024-01-09
申请号：US16684289
申请日：2019-11-14
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Gabriele Gattere , Carlo Valzasina , Federico Vercesi , Giorgio Allegato
CPC classification number: B06B1/0681 , B06B1/0666 , B81B7/0016 , B81C1/00825 , B81B2201/0264 , B81B2201/0271 , B81B2203/0127 , B81B2203/0163
Abstract: An ultrasonic MEMS acoustic transducer formed in a body of semiconductor material having first and second surfaces opposite to one another. A first cavity extends in the body and delimits at the bottom a sensitive portion, which extends between the first cavity and the first surface of the body. The sensitive portion houses a second cavity and forms a membrane that extends between the second cavity and the first surface of the body. An elastic supporting structure extends between the sensitive portion and the body and is suspended over the first cavity.
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