Invention Grant
- Patent Title: High temperature electrostatic chuck
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Application No.: US16381986Application Date: 2019-04-11
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Publication No.: US11133212B2Publication Date: 2021-09-28
- Inventor: Abdul Aziz Khaja , Jun Ma , Hyung Je Woo , Fei Wu , Jian Li
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H01L21/687
Abstract:
A substrate support is disclosed. The substrate support has a dielectric body with a plurality of features formed thereon. A ledge surrounds the plurality of features about a periphery thereof. The features increase in number from a central region of the substrate support towards the ledge. A seasoning layer is optionally disposed on the dielectric body.
Public/Granted literature
- US20190355608A1 HIGH TEMPERATURE ELECTROSTATIC CHUCK Public/Granted day:2019-11-21
Information query
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