Invention Grant
- Patent Title: Semiconductor structure and method for forming the same
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Application No.: US16585677Application Date: 2019-09-27
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Publication No.: US11133224B2Publication Date: 2021-09-28
- Inventor: Hsin-Che Chiang , Yu-San Chien , Ta-Chun Lin , Chun-Sheng Liang , Kuo-Hua Pan
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L27/092 ; H01L29/66 ; H01L21/02 ; H01L29/78

Abstract:
A method for forming a semiconductor structure is provided. The method for forming the semiconductor structure includes forming a first fin structure with a first composition and a second fin structure with a second composition, oxidizing the first fin structure to form a first oxide layer and oxidizing the second fin structure to form a second oxide layer, removing the second oxide layer formed on the second fin structure, oxidizing the second fin structure to form a third oxide layer over the second fin structure, and forming a first metal gate electrode layer over the first oxide layer and a second metal gate electrode layer over the third oxide layer.
Public/Granted literature
- US20210098312A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2021-04-01
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