Invention Grant
- Patent Title: Printed wiring-board islands for connecting chip packages and methods of assembling same
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Application No.: US16642801Application Date: 2017-09-29
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Publication No.: US11134573B2Publication Date: 2021-09-28
- Inventor: Georg Seidemann , Sonja Koller , Bernd Waidhas
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2017/054548 WO 20170929
- International Announcement: WO2019/066950 WO 20190404
- Main IPC: H05K3/34
- IPC: H05K3/34 ; H01L23/498
Abstract:
A printed wiring-board island relieves added complexity to a printed circuit board. The printed wiring-board island creates an island form factor in the printed circuit board. Coupling of a semiconductive device package to the printed wiring-board island includes a ball-grid array. The ball-grid array can at least partially penetrate the printed wiring-board island.
Public/Granted literature
- US20200352035A1 PRINTED WIRING-BOARD ISLANDS FOR CONNECTING CHIP PACKAGES AND METHODS OF ASSEMBLING SAME Public/Granted day:2020-11-05
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