Invention Grant
- Patent Title: Solder alloy and junction structure using same
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Application No.: US16137108Application Date: 2018-09-20
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Publication No.: US11135683B2Publication Date: 2021-10-05
- Inventor: Hidetoshi Kitaura , Akio Furusawa , Kiyohiro Hine
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2017-191443 20170929
- Main IPC: B23K35/26
- IPC: B23K35/26 ; B23K1/00 ; B23K31/02 ; H01L35/08 ; C22C13/02 ; H01L23/00 ; B23K101/40 ; B23K101/42
Abstract:
A solder alloy, includes: about 3 wt % to about 15 wt % of Sb; about 0.01 wt % to about 1.5 wt % of Te; and about 0.005 wt % to about 1 wt % of at least one element selected from the group consisting of Zn, Co, and Cr; and a balance of Sn.
Public/Granted literature
- US20190099840A1 SOLDER ALLOY AND JUNCTION STRUCTURE USING SAME Public/Granted day:2019-04-04
Information query
IPC分类:
