Invention Grant
- Patent Title: System and method of testing a semiconductor device and method of fabricating the semiconductor device
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Application No.: US16272304Application Date: 2019-02-11
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Publication No.: US11137435B2Publication Date: 2021-10-05
- Inventor: Junbae Kim , Yongho Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2018-0087209 20180726
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R1/04 ; G01R31/28 ; G01R31/26

Abstract:
A semiconductor device test system may include a body providing an internal space, in which a test device is loaded, and a cover coupled to the body to cover the internal space. The cover may include a first cover including first openings two-dimensionally arranged and a second cover including second openings two-dimensionally arranged. An arrangement of the first openings may be different from an arrangement of the second openings.
Public/Granted literature
- US20200033389A1 SYSTEM AND METHOD OF TESTING A SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE Public/Granted day:2020-01-30
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