A package structure includes an interposer, a die and a conductive terminal. The interposer includes an encapsulant substrate, a through via and an interconnection structure. The through via is embedded in the encapsulant substrate. The interconnection structure is disposed on a first side of the encapsulant substrate and electrically connected to the through via. The die is electrically bonded to the interposer and disposed over the interconnection structure and the first side of the encapsulant substrate. The conductive terminal is disposed on a second side of the encapsulant substrate vertically opposite to the first side, and electrically connected to the interposer and the die.