Invention Grant
- Patent Title: Doherty amplifier with surface-mount packaged carrier and peaking amplifiers
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Application No.: US16704283Application Date: 2019-12-05
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Publication No.: US11145609B2Publication Date: 2021-10-12
- Inventor: Joseph Gerard Schultz , Jeffrey Kevin Jones , Elie A. Maalouf , Yu-Ting David Wu , Nick Yang
- Applicant: NXP USA, Inc.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Agent Sherry W. Schumm
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/495 ; H03F1/02 ; H03F3/21 ; H03F3/24 ; H05K1/02

Abstract:
An embodiment of a Doherty amplifier includes a module substrate, first and second surface-mount devices coupled to a top surface of the module substrate, and an impedance inverter line assembly. The first and second surface-mount devices include first and second amplifier dies, respectively. The impedance inverter line assembly is electrically connected between outputs of the first and second amplifier dies. The impedance inverter line assembly includes an impedance inverter line coupled to the module substrate, a first lead of the first surface-mount device coupled between the first amplifier die output and a proximal end of the impedance inverter line, and a second lead of the second surface-mount device coupled between the second amplifier die output and a distal end of the impedance inverter line. According to a further embodiment, the impedance inverter line assembly has a 90 degree electrical length at a fundamental operational frequency of the Doherty amplifier.
Public/Granted literature
- US20210175186A1 DOHERTY AMPLIFIER WITH SURFACE-MOUNT PACKAGED CARRIER AND PEAKING AMPLIFIERS Public/Granted day:2021-06-10
Information query
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