Invention Grant
- Patent Title: Semiconductor device including a capacitor
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Application No.: US16439636Application Date: 2019-06-12
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Publication No.: US11145709B2Publication Date: 2021-10-12
- Inventor: Hong-Yang Chen , Tian Sheng Lin , Yi-Cheng Chiu , Hung-Chou Lin , Yi-Min Chen , Kuo-Ming Wu , Chiu-Hua Chung
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/76 ; H01L31/119 ; H01L49/02 ; H01L27/01 ; H01L27/06

Abstract:
A capacitor structure for a power semiconductor device includes a semiconductor substrate, an isolation insulating layer having a ring-shape and including an outer periphery and an inner periphery defining an opening region, a first electrode disposed on the isolation insulating layer, a dielectric layer disposed on the first electrode, and a second electrode disposed on the dielectric layer.
Information query
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