Invention Grant
- Patent Title: Buried local interconnect
-
Application No.: US16223832Application Date: 2018-12-18
-
Publication No.: US11152307B2Publication Date: 2021-10-19
- Inventor: Kangguo Cheng , Lawrence A. Clevenger , Carl Radens , Junli Wang , John H. Zhang
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Joseph Petrokaitis
- Main IPC: H01L23/535
- IPC: H01L23/535 ; H01L29/786 ; H01L21/8238 ; H01L27/12 ; H01L27/11

Abstract:
A semiconductor structure includes a plurality of field effect transistors formed on a substrate including p-type doped field effect transistors (pFETs) and n-type doped field effect transistors (nFETs). A self-aligned buried local interconnect electrically connects a bottom source or drain region of the pFET with an adjacent bottom source or drain region of the nFET. The self-aligned buried local interconnect is serially aligned with and intermediate opposing ends of a gate electrode. Other embodiments include methods for forming the buried local interconnect.
Information query
IPC分类: