Invention Grant
- Patent Title: Printed circuit board and manufacturing method for the same
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Application No.: US16663397Application Date: 2019-10-25
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Publication No.: US11166365B2Publication Date: 2021-11-02
- Inventor: A-ran Lee , Kee-Ju Um , Ju-Ho Kim , Myeong-Hui Jung , Kyuong-Hwan Lim , Jin-Won Lee , Seung-On Kang , Jong-Guk Kim
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2018-0147408 20181126
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/09 ; H05K1/11 ; H05K1/18 ; H05K3/42 ; H05K3/06
Abstract:
A printed circuit board includes: a first insulating layer; and a heat radiating circuit pattern disposed on a first surface of the first insulating layer and having a pad and a via. The heat radiating circuit pattern includes: a first metal layer disposed on the first insulating layer; a graphite layer disposed on the first metal layer; and a second metal layer disposed on the graphite layer.
Public/Granted literature
- US20200170102A1 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME Public/Granted day:2020-05-28
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