公开(公告)号：US11166365B2

公开(公告)日：2021-11-02

申请号：US16663397

申请日：2019-10-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： A-ran Lee ,  Kee-Ju Um ,  Ju-Ho Kim ,  Myeong-Hui Jung ,  Kyuong-Hwan Lim ,  Jin-Won Lee ,  Seung-On Kang ,  Jong-Guk Kim

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/42 ,  H05K3/06

Abstract: A printed circuit board includes: a first insulating layer; and a heat radiating circuit pattern disposed on a first surface of the first insulating layer and having a pad and a via. The heat radiating circuit pattern includes: a first metal layer disposed on the first insulating layer; a graphite layer disposed on the first metal layer; and a second metal layer disposed on the graphite layer.