Invention Grant
- Patent Title: Transistor with isolation below source and drain
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Application No.: US16647695Application Date: 2017-12-20
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Publication No.: US11171207B2Publication Date: 2021-11-09
- Inventor: Willy Rachmady , Cheng-Ying Huang , Matthew V. Metz , Nicholas G. Minutillo , Sean T. Ma , Anand S. Murthy , Jack T. Kavalieros , Tahir Ghani , Gilbert Dewey
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2017/067500 WO 20171220
- International Announcement: WO2019/125424 WO 20190627
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/205 ; H01L29/423 ; H01L29/66 ; H01L29/78

Abstract:
A transistor includes a body of semiconductor material with a gate structure in contact with a portion of the body. A source region contacts the body adjacent the gate structure and a drain region contacts the body adjacent the gate structure such that the portion of the body is between the source region and the drain region. A first isolation region is under the source region and has a top surface in contact with a bottom surface of the source region. A second isolation region is under the drain region and has a top surface in contact with a bottom surface of the drain region. Depending on the transistor configuration, a major portion of the inner-facing sidewalls of the first and second isolation regions contact respective sidewalls of either a subfin structure (e.g., FinFET transistor configurations) or a lower portion of a gate structure (e.g., gate-all-around transistor configuration).
Public/Granted literature
- US20200279916A1 TRANSISTOR WITH ISOLATION BELOW SOURCE AND DRAIN Public/Granted day:2020-09-03
Information query
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