- 专利标题: Variable resistance memory device including silicon capping pattern
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申请号: US16365874申请日: 2019-03-27
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公开(公告)号: US11171287B2公开(公告)日: 2021-11-09
- 发明人: Jong-Uk Kim , Young-Min Ko , Byong-Ju Kim , Kwang-Min Park , Jeong-Hee Park , Dong-Sung Choi
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: F. Chau & Associates, LLC
- 优先权: KR10-2018-0097951 20180822
- 主分类号: H01L45/00
- IPC分类号: H01L45/00 ; H01L27/24
摘要:
A variable resistance memory device may include a memory unit including a first electrode disposed on a substrate, a variable resistance pattern disposed on the first electrode and a second electrode disposed on the variable resistance pattern, a selection pattern disposed on the memory unit, and a capping structure covering a sidewall of the selection pattern. The capping structure may include a first capping pattern and a second capping pattern sequentially stacked on at least one sidewall of the selection pattern. The first capping pattern may be silicon pattern, and the second capping pattern may include a nitride.
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