Invention Grant
- Patent Title: Electronic device comprising communication device including sensing electrode
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Application No.: US16766130Application Date: 2018-11-23
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Publication No.: US11177557B2Publication Date: 2021-11-16
- Inventor: Jongpil Lee , Chanyoul Park , Jaegon Ghim , Kyungwan Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2017-0158909 20171124
- International Application: PCT/KR2018/014482 WO 20181123
- International Announcement: WO2019/103505 WO 20190531
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; G06F3/044 ; H01Q9/04 ; H01Q9/16 ; H01Q21/06

Abstract:
An electronic device according to various embodiments of the present disclosure can comprise: a housing including a first plate, a second plate oriented in the direction opposite to that of the first plate, and a side member surrounding the space between the first plate and the second plate; a plurality of insulating layers interposed between the first plate and the second plate; a printed circuit board in parallel to the second plate; an array of first conductive plates mounted on one layer of the printed circuit board; a second conductive plate mounted on one layer of the printed circuit board so as not to overlap the array when viewing from the top of the second plate; a wireless communication circuit electrically connected to the array and set to provide wireless communication at a frequency of 20-100 GHz; and a grip sensing circuit electrically connected to the second conductive plate. Other various embodiments can be possible.
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