公开(公告)号：US11881647B2

公开(公告)日：2024-01-23

申请号：US17250491

申请日：2019-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaegon Ghim ,  Jeongho Kang ,  Youngmin Lee ,  Yunbum Lee ,  Seongbeom Hong

IPC: H01R12/79 ,  H01P3/08 ,  H04B1/00 ,  H04M1/02

CPC classification number: H01R12/79 ,  H01P3/08 ,  H04B1/0071 ,  H04M1/0274

Abstract: The disclosure relates to an apparatus for connecting modules included in an electronic device, and the apparatus may comprise: a power source between a first module of an electronic device and a second module of the electronic device; at least one line unit including lines for transferring a control signal, an intermediate (IF) signal, or a radio frequency (RF) signal; a first connector unit for connecting at least one of the lines to the first module; a second connector unit for connecting at least one of the lines to the second module; and a connection unit for connecting at least one external apparatus and at least one line for transferring the IF signal or the RF signal from among the lines.

公开(公告)号：US11177557B2

公开(公告)日：2021-11-16

申请号：US16766130

申请日：2018-11-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongpil Lee ,  Chanyoul Park ,  Jaegon Ghim ,  Kyungwan Park

IPC: H01Q1/24 ,  G06F3/044 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q21/06

Abstract: An electronic device according to various embodiments of the present disclosure can comprise: a housing including a first plate, a second plate oriented in the direction opposite to that of the first plate, and a side member surrounding the space between the first plate and the second plate; a plurality of insulating layers interposed between the first plate and the second plate; a printed circuit board in parallel to the second plate; an array of first conductive plates mounted on one layer of the printed circuit board; a second conductive plate mounted on one layer of the printed circuit board so as not to overlap the array when viewing from the top of the second plate; a wireless communication circuit electrically connected to the array and set to provide wireless communication at a frequency of 20-100 GHz; and a grip sensing circuit electrically connected to the second conductive plate. Other various embodiments can be possible.

公开(公告)号：US10778178B2

公开(公告)日：2020-09-15

申请号：US15899121

申请日：2018-02-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaegon Ghim ,  Jeongho Kang ,  Namwoo Kim ,  Yunbum Lee ,  Haimin Lee

IPC: H03H7/46 ,  H04B1/00 ,  H04B1/28 ,  H04W88/02 ,  H04W72/04 ,  H04W8/00 ,  H04B1/403

Abstract: A front end module supporting a plurality of frequency bands and an electronic device includes a plurality of duplexers, a first switch configured to connect any one of the plurality of duplexers to an antenna, a second switch configured to connect a first port, to which a Tx signal of a first communication or a Tx signal of a second communication is input, to any one of Tx ports of the plurality of duplexers, and to connect a second port, from which a Rx signal of the second communication is output, to one of the Tx ports of the plurality of duplexers. According to certain embodiments, the number of switches occupying a large space can be minimized, and thus a space occupied by the front end module supporting device to device (D2D) communication can be reduced.