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公开(公告)号：US11177557B2
公开(公告)日：2021-11-16
申请号：US16766130
申请日：2018-11-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jongpil Lee , Chanyoul Park , Jaegon Ghim , Kyungwan Park
Abstract: An electronic device according to various embodiments of the present disclosure can comprise: a housing including a first plate, a second plate oriented in the direction opposite to that of the first plate, and a side member surrounding the space between the first plate and the second plate; a plurality of insulating layers interposed between the first plate and the second plate; a printed circuit board in parallel to the second plate; an array of first conductive plates mounted on one layer of the printed circuit board; a second conductive plate mounted on one layer of the printed circuit board so as not to overlap the array when viewing from the top of the second plate; a wireless communication circuit electrically connected to the array and set to provide wireless communication at a frequency of 20-100 GHz; and a grip sensing circuit electrically connected to the second conductive plate. Other various embodiments can be possible.
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Patent Agency Ranking
公开(公告)号：US11462846B2
公开(公告)日：2022-10-04
申请号：US16659970
申请日：2019-10-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seunghan Seo , Jongpil Lee
Abstract: According to various embodiments, an electronic device may include a housing including a first plate, a second plate facing away from the first plate, and a side housing surrounding a space between the first plate and the second plate and joined to the second plate or provided integrally with the second plate, a display viewable through at least part of the first plate, a first Printed Circuit Board (PCB) disposed between the first plate and the second plate and including at least one first ground layer, a Flexible Printed Circuit Board (FPCB) at least partially overlapping the first PCB when viewed from above the first plate and including a first end electrically coupled to the first PCB, a second end, and at least one second ground layer, and a conductive structure comprising a conductive material disposed between the first PCB and the FPCB and electrically coupling the first ground layer and the second ground layer.
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公开(公告)号：US11947401B2
公开(公告)日：2024-04-02
申请号：US17559684
申请日：2021-12-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jaegon Lee , Yohan Kwon , Sangho Kim , Seki Kim , Joonseok Kim , Yooseok Shon , Dooseok Yoon , Iksu Lee , Jongpil Lee , Hyongmin Lee , Wookyeong Jeong
Abstract: A system on chip includes a core configured to maintain a clock gating state; a plurality of header switch circuits configured to deliver a supply voltage, which is reduced from an external supply voltage, to the core in response to a plurality of control signals; and a voltage regulator configured to monitor the supply voltage, change logic levels of the plurality of control signals according to a difference level corresponding to a difference between the supply voltage and a preset target voltage, and output the plurality of control signals of which the logic levels have been changed to the plurality of header switch circuits.
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公开(公告)号：US20220253117A1
公开(公告)日：2022-08-11
申请号：US17559684
申请日：2021-12-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jaegon Lee , Yohan Kwon , Sangho Kim , Seki Kim , Joonseok Kim , Yooseok Shon , Dooseok Yoon , Iksu Lee , Jongpil Lee , Hyongmin Lee , Wookyeong Jeong
Abstract: A system on chip includes a core configured to maintain a clock gating state; a plurality of header switch circuits configured to deliver a supply voltage, which is reduced from an external supply voltage, to the core in response to a plurality of control signals; and a voltage regulator configured to monitor the supply voltage, change logic levels of the plurality of control signals according to a difference level corresponding to a difference between the supply voltage and a preset target voltage, and output the plurality of control signals of which the logic levels have been changed to the plurality of header switch circuits.
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公开(公告)号：US10797391B2
公开(公告)日：2020-10-06
申请号：US16687881
申请日：2019-11-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jongpil Lee , Byungjoon Kim , Wonseob Kim , Heejin Park , Hyunchul Hong , Sungchul Park
Abstract: Disclosed herein is an electronic device. The electronic device may include an electronic device may comprising a housing, a first PCB disposed inside the housing, a first wireless communication circuit disposed on the first PCB to transmit and receive signals of a first frequency band, a second PCB disposed inside the housing, wherein the second PCB includes a signal line, an antenna array disposed on the second PCB, a second wireless communication circuit disposed on the second PCB to transmit and receive a signal of a second frequency band using the antenna array, and a conductive member electrically connected to the first wireless communication circuit by the signal line of the second PCB via a feed point for the conductive member.
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公开(公告)号：US20240192752A1
公开(公告)日：2024-06-13
申请号：US18584309
申请日：2024-02-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jaegon LEE , Yohan Kwon , Sangho Kim , Seki Kim , Joonseok Kim , Yooseok Shon , Dooseok Yoon , Iksu Lee , Jongpil Lee , Hyongmin Lee , Wookyeong Jeong
Abstract: A system on chip includes a core configured to maintain a clock gating state; a plurality of header switch circuits configured to deliver a supply voltage, which is reduced from an external supply voltage, to the core in response to a plurality of control signals; and a voltage regulator configured to monitor the supply voltage, change logic levels of the plurality of control signals according to a difference level corresponding to a difference between the supply voltage and a preset target voltage, and output the plurality of control signals of which the logic levels have been changed to the plurality of header switch circuits.
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