Invention Grant
- Patent Title: Stacked coil structure and electronic device including the same
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Application No.: US16444409Application Date: 2019-06-18
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Publication No.: US11177666B2Publication Date: 2021-11-16
- Inventor: Keumsu Song , Kwangseob Kim , Kihyun Kim , Dongzo Kim , Jiwon Kim , Jihye Kim , Yunjeong Noh , Changhak O , Hyungkoo Chung , Mincheol Ha , Jongchul Hong , Yongsang Yun
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2018-0074039 20180627
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F38/14 ; H02J5/00 ; H02J50/12 ; H02J50/40 ; H02J50/70 ; H02J7/02 ; H04B5/00

Abstract:
An electronic device is provided. The electronic device includes a coil unit, a power transmission circuit electrically connected to the coil unit, and a control circuit configured to wirelessly transmit power using the coil unit, and the coil unit may include a first coil. The first coil may include a first layer wound in a first shape by a first number of turns, and a second layer extending from the first layer and wound in a second shape by a second number of turns, and the second layer may be disposed above the first layer to overlap the first layer.
Public/Granted literature
- US20200006949A1 STACKED COIL STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2020-01-02
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |