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公开(公告)号：US20240312937A1
公开(公告)日：2024-09-19
申请号：US18671649
申请日：2024-05-22
发明人： Sung-Min Hwang , Jiwon Kim , Jaeho Ahn , Joon-Sung Lim , Sukkang Sung
IPC分类号： H01L23/00 , G11C16/08 , G11C16/10 , H01L25/00 , H01L25/065 , H01L25/18 , H10B41/27 , H10B41/41 , H10B43/27 , H10B43/40
CPC分类号： H01L24/08 , G11C16/08 , G11C16/10 , H01L24/80 , H01L25/0657 , H01L25/18 , H01L25/50 , H10B41/27 , H10B41/41 , H10B43/27 , H10B43/40 , H01L2224/08135 , H01L2224/80895 , H01L2224/80896 , H01L2924/1431 , H01L2924/14511
摘要： A semiconductor device and electronic system, the device including a cell structure stacked on a peripheral circuit structure, wherein the cell structure includes a first interlayer dielectric layer and first metal pads exposed at the first interlayer dielectric layer and connected to gate electrode layers and channel regions, the peripheral circuit structure includes a second interlayer dielectric layer and second metal pads exposed at the second interlayer dielectric layer and connected to a transistor, the first metal pads include adjacent first and second sub-pads, the second metal pads include adjacent third and fourth sub-pads, the first and third sub-pads are coupled, and a width of the first sub-pad is greater than that of the third sub-pad, and the second sub-pad and the fourth sub-pad are coupled, and a width of the fourth sub-pad is greater than that of the second sub-pad.
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公开(公告)号：US11715684B2
公开(公告)日：2023-08-01
申请号：US17376240
申请日：2021-07-15
发明人： Sungmin Hwang , Jiwon Kim , Jaeho Ahn , Joonsung Lim , Sukkang Sung
IPC分类号： H01L27/115 , H01L23/31 , H01L23/522 , H01L23/00 , H01L25/065 , H01L25/18 , H10B43/27
CPC分类号： H01L23/5223 , H01L23/5226 , H01L23/5227 , H01L23/5228 , H01L24/20 , H01L24/24 , H01L25/0657 , H01L25/18 , H01L2224/2105 , H01L2224/24146 , H01L2924/1431 , H01L2924/14511 , H10B43/27
摘要： A semiconductor device includes lower circuit patterns on a lower substrate; lower bonding patterns on the lower circuit patterns, the lower bonding patterns including a conductive material and being electrically connected to the lower circuit patterns; upper bonding patterns on and contacting the lower bonding patterns, and including a conductive material; a passive device on the upper bonding patterns, and including a conductive material and contacting one of the upper bonding patterns; a gate electrode structure on the passive device, and including gate electrodes spaced apart from each other in a first direction, each of which extends in a second direction, and extension lengths in the second direction of the gate electrodes increasing from a lowermost level toward an uppermost level in a stepwise manner; a channel extending through at least a portion of the gate electrode structure; and an upper substrate on the channel.
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公开(公告)号：US11460695B2
公开(公告)日：2022-10-04
申请号：US17091591
申请日：2020-11-06
发明人： Kyehoon Lee , Jigwang Kim , Jiwon Kim , Jaemin Soh , Sanghoon Lee , Daesu Choi
IPC分类号： G02B27/01 , G02F1/1335 , G02F1/017
摘要： A display apparatus includes a light source array in which a plurality of light sources emitting light by a local dimming are arranged, a color conversion layer comprising color conversion particles that convert the emitted light into light of a certain color, and configured to emit white light by using the converted light, a display panel configured to generate an image by using the white light, and a selective transmission member arranged between the light source array and the color conversion layer. The selective transmission member is configured to transmit the light to the color conversion layer, and avoid transmitting the light in the color conversion layer to the light source array.
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公开(公告)号：US20220173060A1
公开(公告)日：2022-06-02
申请号：US17470644
申请日：2021-09-09
发明人： Jaeho Ahn , Jiwon Kim , Sungmin Hwang , Joonsung Lim , Sukkang Sung
IPC分类号： H01L23/00 , H01L25/065 , H01L25/18
摘要： A nonvolatile memory device and a data storage system including the same are provided. The nonvolatile memory device includes: a first structure including at least one first memory plane; and a second structure bonded to the first structure and including at least one second memory plane, wherein the number of the at least one first memory plane included in the first structure is different from the number of the at least one second memory plane included in the second structure.
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公开(公告)号：US20220157838A1
公开(公告)日：2022-05-19
申请号：US17467568
申请日：2021-09-07
发明人： Jaeho Ahn , Jiwon Kim , Sungmin Hwang , Joonsung Lim , Sukkang Sung
IPC分类号： H01L27/11524 , H01L27/11519 , H01L27/11526 , H01L27/11556 , H01L27/11565 , H01L27/1157 , H01L27/11573 , H01L27/11582 , H01L23/522 , H01L23/528
摘要： A semiconductor device and a data storage system including the same, the semiconductor device including: a first structure including a peripheral circuit; and a second structure, including: a pattern structure; an upper insulating layer; a stack structure between the first structure and the pattern structure and including first and second stack portions spaced apart from each other, the first and second stack portions respectively including horizontal conductive layers and interlayer insulating layers alternately stacked; separation structures penetrating through the stack structure; memory vertical structures penetrating through the first stack portion; and a contact structure penetrating through the second stack portion, the pattern structure, and the upper insulating layer, wherein the contact structure includes a lower contact plug penetrating through at least the second stack portion and an upper contact plug contacting the lower contact plug and extending upwardly to penetrate through the pattern structure and the upper insulating layer.
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公开(公告)号：US11177666B2
公开(公告)日：2021-11-16
申请号：US16444409
申请日：2019-06-18
发明人： Keumsu Song , Kwangseob Kim , Kihyun Kim , Dongzo Kim , Jiwon Kim , Jihye Kim , Yunjeong Noh , Changhak O , Hyungkoo Chung , Mincheol Ha , Jongchul Hong , Yongsang Yun
摘要： An electronic device is provided. The electronic device includes a coil unit, a power transmission circuit electrically connected to the coil unit, and a control circuit configured to wirelessly transmit power using the coil unit, and the coil unit may include a first coil. The first coil may include a first layer wound in a first shape by a first number of turns, and a second layer extending from the first layer and wound in a second shape by a second number of turns, and the second layer may be disposed above the first layer to overlap the first layer.
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7.发明授权公开(公告)号：US10673285B2
公开(公告)日：2020-06-02
申请号：US16283182
申请日：2019-02-22
发明人： Mincheol Ha , Changhak O , Kwangseob Kim , Dongzo Kim , Jiwon Kim , Jongchul Hong , Kihyun Kim , Yunjeong Noh , Jaewan Park , Hyungkoo Chung , Jihye Kim , Keumsu Song , Yongsang Yun , Sangmoo Hwangbo
摘要： Various embodiments related to electronic devices are set forth herein. According to an embodiment, an electronic device comprises a coil, a power transmitting circuit electrically connected with the coil, a sensing circuit, and a control circuit. The control circuit is configured to wirelessly output, using the power transmitting circuit, a first designated power through the coil to an external electronic device, and identify, using the sensing circuit, first energy detected at the coil due to a foreign object of the electronic device. The control circuit is further configured to, when a magnitude of the energy falls within a first designated range, output, using the power transmitting circuit, a second designated power to the external electronic device, and when the magnitude of the energy falls within a second designated range, abstain from outputting the power to the external electronic device using the power transmitting circuit. Other embodiments are possible as well.
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公开(公告)号：US10607060B2
公开(公告)日：2020-03-31
申请号：US15821269
申请日：2017-11-22
发明人： Chaekyung Lee , Jiwon Kim , Won Lee , Bo-Keun Kim , Inkyeong Shin
摘要： An apparatus and method for setting a fingerprint recognition region in an electronic device are provided. An electronic device includes a display, a finger scan sensor overlapped with at least a partial region of the display, and a processor. The processor controls to detect a touch input for at least one object displayed at the display, when detecting a first fingerprint image through a fingerprint recognition region corresponding to the touch input, enlarge a size of the fingerprint recognition region, detect a second fingerprint image through the enlarged fingerprint recognition region, and when having succeeded in user authentication by using the second fingerprint image, perform a function corresponding to the at least one object.
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公开(公告)号：US12015335B2
公开(公告)日：2024-06-18
申请号：US17057234
申请日：2019-07-02
发明人： Mincheol Ha , Kwangseob Kim , Kihyun Kim , Dongzo Kim , Jiwon Kim , Jihye Kim , Yunjeong Noh , Keumsu Song , Changhak O , Kyungmin Lee , Hyungkoo Chung , Jongchul Hong , Yongsang Yun
CPC分类号： H02M1/44 , H02J7/007182 , H02J50/12 , H02J50/402 , H02J50/80 , H02M3/33573
摘要： Various embodiments relating to an electronic device are disclosed, and according to an embodiment, the electronic device may comprise: a plurality of coils; a first power generation circuit electrically connected to at least one of the plurality of coils; a second power generation circuit electrically connected to at least one of the plurality of coils; and a control circuit, wherein when the approach of a second external electronic device is detected while first power is provided to a first external electronic device by using a first frequency via the first power generation circuit, the control circuit allows the frequency of the second power generation circuit to be configured to a second frequency different from a first frequency in order to provide second power to the second external electronic device. Other embodiments may be possible.
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10.发明公开公开(公告)号：US20240164101A1
公开(公告)日：2024-05-16
申请号：US18355450
申请日：2023-07-20
发明人： Jiwon Kim , Jiyoung Kim , Woosung Yang , Dohyung Kim , Sukkang Sung
IPC分类号： H10B43/27 , H01L23/522 , H01L23/528 , H01L25/065 , H10B41/10 , H10B41/27 , H10B41/35 , H10B41/41 , H10B43/10 , H10B43/35 , H10B43/40 , H10B80/00
CPC分类号： H10B43/27 , H01L23/5226 , H01L23/5283 , H01L25/0652 , H10B41/10 , H10B41/27 , H10B41/35 , H10B41/41 , H10B43/10 , H10B43/35 , H10B43/40 , H10B80/00 , H01L2225/06541
摘要： Disclosed are 3D semiconductor memory devices and electronic systems including the same. The 3D semiconductor memory device comprises a first substrate, a peripheral circuit structure on the first substrate, and a cell array structure on the peripheral circuit structure. The cell array structure includes a second substrate, a stack structure between the second substrate and the peripheral circuit structure and including interlayer dielectric layers and conductive patterns that are stacked alternately with the interlayer dielectric layers, vertical channel structures that include respective portions the stack structure and include vertical semiconductor patterns, respectively, and connection vias that include respective portions the second substrate and are connected to respective top surfaces of the vertical semiconductor patterns.
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