A solder printing inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder on the substrate on which a thermosetting adhesive is applied, the solder printing inspection device including: an irradiator that irradiates the solder with light; an imaging device that takes an image of the irradiated solder; a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group; outputs mounting position adjustment information to the component mounting machine.