Invention Grant
- Patent Title: Semiconductor device including an antenna
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Application No.: US15045687Application Date: 2016-02-17
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Publication No.: US11195787B2Publication Date: 2021-12-07
- Inventor: Ngoc-Hoa Huynh , Franz-Xaver Muehlbauer , Claus Waechter , Veronika Huber , Dominic Maier , Thomas Kilger , Saverio Trotta , Ashutosh Baheti , Georg Meyer-Berg , Maciej Wojnowski
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/498 ; H01L23/367 ; H01L23/538 ; H01Q9/28 ; H01Q1/22 ; H01Q9/04 ; H01Q21/06 ; H01L21/56 ; H01Q9/26
Abstract:
A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.
Public/Granted literature
- US20170236776A1 SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA Public/Granted day:2017-08-17
Information query
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