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    Gesture feedback in distributed neural network system
    3.
    发明授权
    Gesture feedback in distributed neural network system 有权

    公开(公告)号：US11640208B2

    公开(公告)日：2023-05-02

    申请号：US16691021

    申请日：2019-11-21

    Applicant: Infineon Technologies AG

    Inventor： Souvik Hazra ,  Ashutosh Baheti ,  Avik Santra

    IPC: G06N3/08 ,  G06N3/04 ,  G01S7/41 ,  G06K9/62 ,  G06F3/01 ,  G06V40/20 ,  G06V10/82

    Abstract: A method for operating a distributed neural network having a plurality of intelligent devices and a server includes: generating, by a first intelligent device of the plurality of intelligent devices, a first output using a first neural network model running on the first intelligent device and using a first input vector to the first neural network model; outputting, by the first intelligent device, the first output; receiving, by the first intelligent device, a gesture feedback on the first output from a user; determining, by the first intelligent device, a user rating of the first output from the gesture feedback; labeling, by the first intelligent device, the first input vector with a first label in accordance with the user rating; and training, by the first intelligent device, the first neural network model using the first input vector and the first label.

    Antenna Package and Method of Formation Thereof
    6.
    发明申请
    Antenna Package and Method of Formation Thereof 有权

    公开(公告)号：US20220085484A1

    公开(公告)日：2022-03-17

    申请号：US17022408

    申请日：2020-09-16

    Applicant: Infineon Technologies AG

    Inventor： Eung San Cho ,  Ashutosh Baheti ,  Saverio Trotta

    IPC: H01Q1/22 ,  H01Q1/38 ,  H01Q9/04

    Abstract: A semiconductor system includes a semiconductor chip comprising a RF circuit, a buffer layer over the RF circuit and a plurality of bumps over the buffer layer, wherein the plurality of bumps comprising at least one functional bump electrically connected to the RF circuit, and at least one dummy bump which is maintained at a distance from the RF circuit and prevented from being electrically connected to the RF circuit by the buffer layer, a conductive layer disposed over the semiconductor chip and coupled to the plurality of bumps through a plurality of vias, a feedline structure disposed over the conductive layer, wherein the feedline structure is electrically coupled to the RF circuit, and a plurality of antennas disposed over the feedline structure, wherein at least one antenna of the plurality of antennas is coupled to the RF circuit through the feedline structure.

    Millimeter-Wave Circuit with Dielectric Lens
    7.
    发明申请
    Millimeter-Wave Circuit with Dielectric Lens 有权

    公开(公告)号：US20220077592A1

    公开(公告)日：2022-03-10

    申请号：US17461080

    申请日：2021-08-30

    Applicant: Infineon Technologies AG

    Inventor： Nadine Pfuhl ,  Marwa Abdel-Aziz ,  Ashutosh Baheti ,  Saverio Trotta

    IPC: H01Q19/08 ,  H01Q19/30

    Abstract: An electronic device includes a housing, an electrically conductive layer and millimeter-wave (mmw) circuitry configured to emit a mmw signal. The mmw circuitry is arranged in the housing and on a first side of the electrically conductive layer. The housing comprises at least one portion configured as a dielectric lens to refract the mmw signal at least partially outside the housing towards a second side opposite to the first side of the electrically conductive layer.

    ANTENNA-IN-PACKAGE PRODUCTION TEST
    10.
    发明申请
    ANTENNA-IN-PACKAGE PRODUCTION TEST 有权

    公开(公告)号：US20210033668A1

    公开(公告)日：2021-02-04

    申请号：US16528199

    申请日：2019-07-31

    Applicant: Infineon Technologies AG

    Inventor： Saverio Trotta ,  Ashutosh Baheti ,  Reinhard-Wolfgang Jungmaier ,  Dennis Noppeney

    IPC: G01R31/302 ,  G01R1/04 ,  H01Q1/22 ,  H04B17/17

    Abstract: A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

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