- Patent Title: Semiconductor memory device and method of manufacturing the same
-
Application No.: US16804403Application Date: 2020-02-28
-
Publication No.: US11195844B2Publication Date: 2021-12-07
- Inventor: Kensuke Ota , Masumi Saitoh , Kiwamu Sakuma
- Applicant: Kioxia Corporation
- Applicant Address: JP Minato-ku
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2019-160949 20190904
- Main IPC: H01L27/1157
- IPC: H01L27/1157 ; H01L27/11565 ; H01L27/11573 ; H01L27/11529 ; H01L27/11524 ; H01L27/11539 ; H01L27/11519

Abstract:
A semiconductor memory device includes a substrate, a plurality of conductive layers, a first semiconductor layer, a memory portion, and a drive circuit which drives the memory cell. The conductive layers are provided in a first region, a second region, and a third region different from the first region and the second region, and a portion positioned in the third region is insulated from a portion positioned in the first region and the second region. The drive circuit is provided in the third region, and includes a second semiconductor layer, and an insulating layer, and one end of the second semiconductor layer is connected to the conductive layers in the second region and the other end of the second semiconductor layer is connected to the substrate.
Public/Granted literature
- US20210066316A1 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-03-04
Information query
IPC分类: