Invention Grant
- Patent Title: Organic mold interconnects in shielded interconnects frames for integrated-circuit packages
-
Application No.: US16912653Application Date: 2020-06-25
-
Publication No.: US11205613B2Publication Date: 2021-12-21
- Inventor: Jiun Hann Sir , Eng Huat Goh , Poh Boon Khoo
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Priority: MYPI2019005652 20190926
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/498 ; H01L21/48
Abstract:
A molded frame interconnect includes power, ground and signal frame interconnects in a molded mass, that encloses an integrated-circuit package precursor, which is inserted into the frame, and coupled to the frame interconnects by a build-up redistribution layer.
Public/Granted literature
- US20210098352A1 ORGANIC MOLD INTERCONNECTS IN SHIELDED INTERCONNECTS FRAMES FOR INTEGRATED-CIRCUIT PACKAGES Public/Granted day:2021-04-01
Information query
IPC分类:
