- 专利标题: Optimizing gate profile for performance and gate fill
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申请号: US15525571申请日: 2014-12-22
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公开(公告)号: US11205707B2公开(公告)日: 2021-12-21
- 发明人: Nadia M. Rahhal-Orabi , Tahir Ghani , Willy Rachmady , Matthew V. Metz , Jack T. Kavalieros , Gilbert Dewey , Anand S. Murthy , Chandra S. Mohapatra
- 申请人: INTEL CORPORATION
- 申请人地址: US CA Santa Clara
- 专利权人: INTEL CORPORATION
- 当前专利权人: INTEL CORPORATION
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt P.C.
- 国际申请: PCT/US2014/071978 WO 20141222
- 国际公布: WO2016/105348 WO 20160630
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L21/28 ; H01L29/423 ; H01L29/78
摘要:
Systems and methods of optimizing a gate profile for performance and gate fill are disclosed. A semiconductor device having an optimized gate profile includes a semiconductor substrate and a fin extending above the semiconductor substrate. A pair of source and drain regions are disposed on opposite sides of a channel region. A gate stack is disposed over the channel region, where the gate stack includes a top portion separated from a bottom portion by a tapered portion. The top portion and at least a portion of the tapered portion are disposed above the fin.
公开/授权文献
- US20170330955A1 OPTIMIZING GATE PROFILE FOR PERFORMANCE AND GATE FILL 公开/授权日:2017-11-16
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