Invention Grant
- Patent Title: III-N multichip modules and methods of fabrication
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Application No.: US16890937Application Date: 2020-06-02
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Publication No.: US11211245B2Publication Date: 2021-12-28
- Inventor: Khaled Ahmed , Anup Pancholi , John Heck , Thomas Sounart , Harel Frish , Sansaptak Dasgupta
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard, Mughal LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/02 ; H01L21/8234 ; H01L21/8222

Abstract:
A device includes a layer including a first III-Nitride (III-N) material, a channel layer including a second III-N material, a release layer including nitrogen and a transition metal, where the release layer is between the first III-N material and the second III-N material. The device further includes a polarization layer including a third III-N material above the release layer, a gate structure above the polarization layer, a source structure and a drain structure on opposite sides of the gate structure where the source structure and the drain structure each include a fourth III-N material. The device further includes a source contact on the source structure and a drain contact on the drain structure.
Public/Granted literature
- US20210375620A1 III-N MULTICHIP MODULES AND METHODS OF FABRICATION Public/Granted day:2021-12-02
Information query
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