Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16899819Application Date: 2020-06-12
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Publication No.: US11211457B2Publication Date: 2021-12-28
- Inventor: Eunhye Choi , Seung Mo Kang , Jungtaek Kim , Moon Seung Yang , Jongryeol Yoo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2019-0070028 20190613
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/08 ; H01L29/78 ; H01L29/423 ; H01L29/66

Abstract:
A semiconductor device including an insulating layer on a substrate; channel semiconductor patterns stacked on the insulating layer and vertically spaced apart from each other; a gate electrode crossing the channel semiconductor patterns; source/drain regions respectively at both sides of the gate electrode and connected to each other through the channel semiconductor patterns, the source/drain regions having concave bottom surfaces; and air gaps between the insulating layer and the bottom surfaces of the source/drain regions.
Information query
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