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公开(公告)号:US11688813B2
公开(公告)日:2023-06-27
申请号:US17584545
申请日:2022-01-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seung Mo Kang , Moon Seung Yang , Jongryeol Yoo , Sihyung Lee , Sunguk Jang , Eunhye Choi
IPC: H01L29/786 , H01L29/08 , H01L29/423 , H01L29/06 , H01L29/66 , H01L29/78 , H01L27/088 , H01L21/8234 , H01L21/311 , H01L21/02 , H01L21/324
CPC classification number: H01L29/78696 , H01L21/02532 , H01L21/02636 , H01L21/02664 , H01L21/311 , H01L21/3247 , H01L21/823418 , H01L21/823437 , H01L21/823468 , H01L27/0886 , H01L29/0673 , H01L29/0847 , H01L29/42392 , H01L29/66545 , H01L29/66575 , H01L29/785 , H01L29/7848
Abstract: A semiconductor device includes a channel pattern including first and second semiconductor patterns stacked on a substrate, a gate electrode covering top and lateral surfaces of the channel pattern and extending in a first direction, and including a first gate segment between the first semiconductor pattern and the second semiconductor pattern, a gate spacer covering a lateral surface of the gate electrode and including an opening exposing the channel pattern, and a first source/drain pattern on a side of the gate spacer and in contact with the channel pattern through the opening, the first source/drain pattern including a sidewall center thickness at a height of the first gate segment and at a center of the opening, and a sidewall edge thickness at the height of the first gate segment and at an edge of the opening, the sidewall edge thickness being about 0.7 to 1 times the sidewall center thickness.
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公开(公告)号:US11251313B2
公开(公告)日:2022-02-15
申请号:US16774653
申请日:2020-01-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seung Mo Kang , Moon Seung Yang , Jongryeol Yoo , Sihyung Lee , Sunguk Jang , Eunhye Choi
IPC: H01L29/786 , H01L29/423 , H01L29/08 , H01L29/06 , H01L29/66 , H01L29/78 , H01L27/088 , H01L21/8234 , H01L21/311
Abstract: A semiconductor device includes a channel pattern including first and second semiconductor patterns stacked on a substrate, a gate electrode covering top and lateral surfaces of the channel pattern and extending in a first direction, and including a first gate segment between the first semiconductor pattern and the second semiconductor pattern, a gate spacer covering a lateral surface of the gate electrode and including an opening exposing the channel pattern, and a first source/drain pattern on a side of the gate spacer and in contact with the channel pattern through the opening, the first source/drain pattern including a sidewall center thickness at a height of the first gate segment and at a center of the opening, and a sidewall edge thickness at the height of the first gate segment and at an edge of the opening, the sidewall edge thickness being about 0.7 to 1 times the sidewall center thickness.
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公开(公告)号:US11211457B2
公开(公告)日:2021-12-28
申请号:US16899819
申请日:2020-06-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Eunhye Choi , Seung Mo Kang , Jungtaek Kim , Moon Seung Yang , Jongryeol Yoo
IPC: H01L29/10 , H01L29/08 , H01L29/78 , H01L29/423 , H01L29/66
Abstract: A semiconductor device including an insulating layer on a substrate; channel semiconductor patterns stacked on the insulating layer and vertically spaced apart from each other; a gate electrode crossing the channel semiconductor patterns; source/drain regions respectively at both sides of the gate electrode and connected to each other through the channel semiconductor patterns, the source/drain regions having concave bottom surfaces; and air gaps between the insulating layer and the bottom surfaces of the source/drain regions.
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公开(公告)号:US11710772B2
公开(公告)日:2023-07-25
申请号:US17560865
申请日:2021-12-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Eunhye Choi , Seung Mo Kang , Jungtaek Kim , Moon Seung Yang , Jongryeol Yoo
IPC: H01L29/10 , H01L29/08 , H01L29/78 , H01L29/423 , H01L29/66
CPC classification number: H01L29/105 , H01L29/0852 , H01L29/1079 , H01L29/42356 , H01L29/66712 , H01L29/7802
Abstract: A semiconductor device including an insulating layer on a substrate; channel semiconductor patterns stacked on the insulating layer and vertically spaced apart from each other; a gate electrode crossing the channel semiconductor patterns; source/drain regions respectively at both sides of the gate electrode and connected to each other through the channel semiconductor patterns, the source/drain regions having concave bottom surfaces; and air gaps between the insulating layer and the bottom surfaces of the source/drain regions.
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公开(公告)号:US11133421B2
公开(公告)日:2021-09-28
申请号:US16808857
申请日:2020-03-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Moon Seung Yang , Eun Hye Choi , Seung Mo Kang , Yong Seung Kim , Jung Taek Kim , Min-Hee Choi
IPC: H01L29/786 , H01L29/06 , H01L29/66 , H01L21/02 , H01L29/423
Abstract: A semiconductor device includes a fin-type pattern on a substrate, the fin-type pattern extending in a first direction and protruding from the substrate in a third direction, a first wire pattern on the fin-type pattern, the first wire pattern being spaced apart from the fin-type pattern in the third direction, and a gate electrode extending in a second direction, which is perpendicular to the first and third directions, and surrounding the first wire pattern, the gate electrode including a first portion that overlaps with the fin-type pattern in the second direction and a second portion corresponding to a remainder of the gate electrode except for the first portion.
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公开(公告)号:US11569389B2
公开(公告)日:2023-01-31
申请号:US17470341
申请日:2021-09-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Moon Seung Yang , Eun Hye Choi , Seung Mo Kang , Yong Seung Kim , Jung Taek Kim , Min-Hee Choi
IPC: H01L29/786 , H01L29/06 , H01L29/423
Abstract: A semiconductor device includes a fin-type pattern on a substrate, the fin-type pattern extending in a first direction and protruding from the substrate in a third direction, a first wire pattern on the fin-type pattern, the first wire pattern being spaced apart from the fin-type pattern in the third direction, and a gate electrode extending in a second direction, which is perpendicular to the first and third directions, and surrounding the first wire pattern, the gate electrode including a first portion that overlaps with the fin-type pattern in the second direction and a second portion corresponding to a remainder of the gate electrode except for the first portion.
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公开(公告)号:US10206490B2
公开(公告)日:2019-02-19
申请号:US15206392
申请日:2016-07-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seung Mo Kang , Tae Seuk Kang , Cheol Hee Kim , Joon Young Jo , Jong Sun Baek , Heon Yeap Baek , Min Woo Yoo
Abstract: An accessory device comprising: a first cover arranged to be opened and closed when the first cover is mounted on an electronic device, the first cover comprising a first plate, at least one first side wall protruding from the first plate in a first direction, and a first film disposed in a space defined by the sidewall and the plate, wherein the first film and the first side wall are at least partially transparent, and wherein the first film comprises a first layer disposed on the first plate, the first layer being at least partially reflective, a second layer disposed on the first layer, the second layer being at least partially formed of a polymeric material, and a third layer that is disposed on the second layer, the third layer being an anti-wear layer.
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