A device and methods for forming the device is provided. The device includes a substrate and circuit elements thereon. The device further includes a metallization layer over the substrate. The metallization layer includes interconnects interconnecting the circuit elements. A test pad is disposed over an uppermost interconnect in the metallization layer. The test pad is coupled to one or more circuit elements via the interconnects. The test pad is configured for testing the one or more circuit elements. A crack stop protection seal surrounding the test pad is provided. The crack stop protection seal confines damage caused by probing at the test pad from propagating to an area beyond the crack stop protection seal.