Invention Grant
- Patent Title: Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design rule
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Application No.: US16774642Application Date: 2020-01-28
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Publication No.: US11219129B2Publication Date: 2022-01-04
- Inventor: Mikael Tuominen
- Applicant: AT&S (China) Co. Ltd.
- Applicant Address: CN Shanghai
- Assignee: AT&S (China) Co. Ltd.
- Current Assignee: AT&S (China) Co. Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: CN201910101367.5 20190131
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/03 ; H05K1/05 ; H05K1/11 ; H05K1/16 ; H05K1/18 ; H05K3/00 ; H05K3/10 ; H05K3/12 ; H05K3/30 ; H05K3/40 ; H05K3/42 ; H05K3/46 ; H01L21/28 ; H01L21/46 ; H01L21/48 ; H01L21/56 ; H01L21/465 ; H01L21/471 ; H01L21/473 ; H01L21/768 ; H01L21/4763 ; H01L23/00 ; H01L23/29 ; H01L23/48 ; H01L23/498 ; H01L23/538
Abstract:
A component carrier with a stack including at least one electrically insulating layer structure and at least one electrically insulating structure has a tapering blind hole formed in the stack and an electrically conductive plating layer extending along at least part of a horizontal surface of the stack outside of the blind hole and along at least part of a surface of the blind hole. A minimum thickness of the plating layer at a bottom of the blind hole is at least 8 μm.
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