Invention Grant
- Patent Title: Methods and apparatus for semi-dynamic bottom up reflow
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Application No.: US16902655Application Date: 2020-06-16
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Publication No.: US11222816B2Publication Date: 2022-01-11
- Inventor: Lanlan Zhong , Shirish A. Pethe , Fuhong Zhang , Joung Joo Lee , Kishor Kalathiparambil , Xiangjin Xie , Xianmin Tang
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/321 ; H01L23/532
Abstract:
A method of filling structures on a substrate uses a semi-dynamic reflow process. The method may include depositing a metallic material on the substrate at a first temperature, heating the substrate to a second temperature higher than the first temperature wherein heating of the substrate causes a static reflow of the deposited metallic material on the substrate, stopping heating of the substrate, and depositing additional metallic material on the substrate causing a dynamic reflow of the deposited additional metallic material on the substrate. RF bias power may be applied during the dynamic reflow to facilitate in maintaining the temperature of the substrate.
Public/Granted literature
- US20210391214A1 METHODS AND APPARATUS FOR SEMI-DYNAMIC BOTTOM UP REFLOW Public/Granted day:2021-12-16
Information query
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