An object of the present invention is to provide an imprinting curable composition which includes a silicon-containing polymerizable compound such as polysiloxane, exhibits outstanding adhesion to a substrate and excellent demoldability from a fine pattern mold, and causes very little mold contamination. The object is attained by providing a photo-imprinting curable composition including a polymerizable compound (A) containing a silicon atom in the molecule, a photopolymerization initiator (B) and an additive (C), the additive (C) being a compound represented by the following formula (C1) or (C2): R1OC2H4OnX1  (C1) X2OC2H4OpC3H6OqC2H4OrX3  (C2) (In the formula (C1), R1 is a C12-30 alkyl group, X1 is a hydrogen atom or an acyl group, and n is an integer of 0 to 50. In the formula (C2), X2 and X3 are each independently a hydrogen atom or an acyl group, and p, q and r are each independently an integer of 1 to 50).