Invention Grant
- Patent Title: Mechanisms for forming bonding structures
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Application No.: US16703095Application Date: 2019-12-04
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Publication No.: US11233032B2Publication Date: 2022-01-25
- Inventor: Yeong-Jyh Lin , Hsin-Hung Liao , Chien-Ling Hwang , Bor-Ping Jang , Hsiao-Chung Liang , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/48 ; H01L25/065 ; H01L25/10 ; H01L25/00 ; H01L23/498 ; H01L25/11 ; H01L25/03
Abstract:
Embodiments of mechanisms for forming a package are provided. The package includes a substrate and a contact pad formed on the substrate. The package also includes a conductive pillar bonded to the contact pad through solder formed between the conductive pillar and the contact pad. The solder is in direct contact with the conductive pillar.
Information query
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