- Patent Title: Expediting spectral measurement in semiconductor device fabrication
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Application No.: US16934123Application Date: 2020-07-21
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Publication No.: US11237120B2Publication Date: 2022-02-01
- Inventor: Vincent Immer , Tal Marciano , Etay Lavert
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Hodgson Russ LLP
- Main IPC: G01N21/45
- IPC: G01N21/45 ; G01N21/95 ; G01N21/956 ; G01N21/55 ; G03F7/20 ; G01N21/31 ; G02B21/00 ; G02B21/08 ; G01B11/06 ; G01J3/453 ; G02B21/06 ; G02B21/18 ; G02B21/36 ; H01L21/67 ; H01L21/66
Abstract:
A device and method for expediting spectral measurement in metrological activities during semiconductor device fabrication through interferometric spectroscopy of white light illumination during calibration, overlay, and recipe creation.
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