Invention Grant
- Patent Title: Semiconductor device and method of manufacturing same
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Application No.: US17110493Application Date: 2020-12-03
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Publication No.: US11239337B2Publication Date: 2022-02-01
- Inventor: Tetsuya Yoshida
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: SGPatents PLLC
- Priority: JP2017-187976 20170928
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/51 ; H01L29/417 ; H01L29/66 ; H01L21/84 ; H01L27/12 ; H01L29/786 ; H01L29/49 ; H01L27/092 ; H01L29/10 ; H01L21/8238

Abstract:
To provide a semiconductor device having improved reliability. The semiconductor device has, on a SOI substrate thereof having a semiconductor substrate, an insulating layer, and a semiconductor layer, a gate insulating film having an insulating film and a high dielectric constant film. The high dielectric constant film has a higher dielectric constant than a silicon oxide film and includes a first metal and a second metal. In the high dielectric constant film, the ratio of the number of atoms of the first metal to the total number of atoms of the first metal and the second metal is equal to or more than 75%, and less than 100%.
Public/Granted literature
- US20210091203A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME Public/Granted day:2021-03-25
Information query
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