Invention Grant
- Patent Title: Adhesive tape for encapsulating electronic constructions
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Application No.: US16321106Application Date: 2017-07-17
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Publication No.: US11242469B2Publication Date: 2022-02-08
- Inventor: Christian Schuh , Thorsten Krawinkel
- Applicant: TESA SE
- Applicant Address: DE Norderstedt
- Assignee: TESA SE
- Current Assignee: TESA SE
- Current Assignee Address: DE Norderstedt
- Agency: Norris McLaughlin, P.A.
- Priority: DE102016213840.5 20160727
- International Application: PCT/EP2017/067986 WO 20170717
- International Announcement: WO2018/019631 WO 20180201
- Main IPC: C09J7/29
- IPC: C09J7/29 ; C09J7/40 ; C09J7/21 ; C09J7/24 ; C09J7/26 ; C09J7/25 ; C09J7/38 ; B32B27/14 ; C08K3/38 ; C08K3/36 ; C08K3/34 ; C09J7/20 ; C08K3/22 ; C08K3/26 ; C08K3/30

Abstract:
The aim is to provide an adhesive tape that effectively protects an electronic construction from permeants, especially water, and that at the same time has good gap-filling qualities. To solve this problem an adhesive tape is proposed that has in the following order:—a carrier layer without barrier effect at least towards water and with a WVTR of at least 1 g/(m2*d) (38° C., 90% relative humidity, 50 μm layer thickness); —a layer comprising at least one getter material capable of sorbing at least water; —a water barrier ply; and—a layer of pressure-sensitive adhesive, where the carrier layer bears an outward-facing release layer and/or the layer of pressure-sensitive adhesive is lined with a release liner which has a release layer lying on the layer of pressure-sensitive adhesive.
Public/Granted literature
- US20190161648A1 ADHESIVE TAPE FOR ENCAPSULATING ELECTRONIC CONSTRUCTIONS Public/Granted day:2019-05-30
Information query
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