发明授权
- 专利标题： Adhesive film
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申请号： US16486522申请日： 2018-02-14
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公开(公告)号： US11242472B2公开(公告)日： 2022-02-08
- 发明人: Tetsuyuki Shirakawa , Hiroyuki Izawa , Takahiro Fukui , Tatsuya Kumada
- 申请人： HITACHI CHEMICAL COMPANY, LTD.
- 申请人地址： JP Tokyo
- 专利权人： HITACHI CHEMICAL COMPANY, LTD.
- 当前专利权人： HITACHI CHEMICAL COMPANY, LTD.
- 当前专利权人地址： JP Tokyo
- 代理机构： Fitch, Even, Tabin & Flannery, LLP
- 优先权： JPJP2017-027983 20170217,JPJP2017-027985 20170217
- 国际申请： PCT/JP2018/005012 WO 20180214
- 国际公布： WO2018/151131 WO 20180823
- 主分类号： C09J9/02
- IPC分类号： C09J9/02 ; C08K3/08 ; C09J11/04 ; C09J201/00
摘要：
One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.
信息查询
IPC分类:
